High Voltage Power Module with Corona Extenders
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Solution Overview
Problem
Existing high voltage power modules are limited by high parasitic losses, inadequate thermal management, and mechanical stress at high temperatures, which restrict their efficiency and reliability in high voltage and high temperature operations.
Innovation Solution
A low profile power module design featuring a copper baseplate, direct bond copper with AlN, and a high temperature plastic lid with corona extenders, utilizing a power flip-chip attach method and bolted connections to minimize parasitic impedances and thermal resistance, while providing mechanical and electrical isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional high voltage power modules are used, then they can provide basic power conversion functionality, but they suffer from high parasitic losses that reduce efficiency
Solution Approach 1:
The power module is divided into functionally independent segments: power die mounted on substrate, separate baseplate for thermal management, and distinct interconnection layers. This segmentation allows optimization of each component to minimize parasitic losses while maintaining overall system efficiency.
Solution Approach 2:
The patent transitions from planar two-dimensional layouts to three-dimensional vertical stacking of power die, substrates, and baseplates. This dimensional change reduces current path lengths and parasitic inductance, thereby reducing energy losses during power conversion operations.
2Loss of energy
If conventional thermal management approaches are used, then basic cooling is provided, but thermal resistance from junction to case remains high limiting power dissipation capacity
Solution Approach 1:
The baseplate is directly coupled to the substrate in a merged thermal path configuration, eliminating intermediate thermal interfaces. This merging of thermal management components creates a low-resistance heat flow path from the power die junction through the substrate to the baseplate, significantly reducing junction-to-case thermal resistance and increasing power dissipation capacity.
3Reliability
If standard mechanical mounting methods are used, then power die can be attached to substrate, but mechanical stress and reliability issues occur at high temperatures
Solution Approach 1:
The patent employs advanced bonding parameters and materials specifically selected for high-temperature stability. By changing the bonding parameters (temperature, pressure, time) and using materials with matched thermal expansion coefficients, the assembly maintains mechanical integrity and reliability under high-temperature operating conditions while minimizing thermal-mechanical stress.
4Volume of moving object
If compact packaging is pursued, then module size is reduced, but electrical isolation and corona discharge prevention become difficult
Solution Approach 1:
The patent utilizes vertical three-dimensional spacing and positioning of electrical conductors, insulation barriers, and corona extenders to provide adequate electrical isolation distances without increasing the module's horizontal footprint. This dimensional approach allows compact packaging while maintaining sufficient clearance to prevent corona discharge in high-voltage applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves reduced parasitic losses, improved thermal management, and enhanced reliability by minimizing thermal-mechanical stress, allowing for efficient operation at high voltages and temperatures with reduced module size and weight.
Implementation Method 1
A baseplate of copper or copper alloy material is provided. The copper material provides excellent thermal conductivity for heat dissipation from the power die.
Implementation Method 2
The lid includes corona extenders positioned around the blade apertures to allow for high voltage applications. Corona extenders are used to control and prevent corona discharge in high voltage environments.
Implementation Method 3
The power die are compressively held between the power substrate and the printed circuit board. Compressive force improves thermal contact and electrical connection between components.
Data Source
AI summary
A power die module using a compression connection to a power die in a small package with corona extenders positioned around short efficient path exterior electrical connections. The module is built from a baseplate with connected sidewalls forming an interior compartment holding a power substrate with attached threaded inserts. A printed circuit board bolted to the power substrate with high voltage power die compressively held between the board and the substrate. The compressive hold enhances the electrical connections between the contacts on the top and bottom of the power die and either the power substrate or the printed circuit board. Exterior blade connectors extend upward from the printed circuit board through blade apertures in a lid that covers the interior compartment. The lid includes corona extenders positioned around the blade apertures to allow for high voltage applications while maintaining a small size lightweight package. The sidewall has a perimeter that also includes one or more corona extenders.