High-Voltage Push-to-Mate Interconnect Self-Alignment

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing high-voltage electrical interconnect devices pose challenges in precise manipulation, especially when using robotics or remote manipulators, leading to increased costs and risks of electrical accidents due to the need for precise alignment and potential lack of ground connections, which can result in electrical noise and shock.

Innovation Solution

A self-aligning push-to-mate electrical interconnect device with a housing, insulator bushing, and center pin, featuring a dielectric insulator bushing with a dielectric strength greater than air, and an external grounding strap to ensure secure and safe high-voltage connections, reducing the risk of electrical shock and noise interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If existing high-voltage interconnect devices are used, then connections can be made in confined spaces with robotics or remote manipulators, but precise manipulation of components is required which increases complexity and risk

Engineering Contradiction:
Improveability to connect in confined spaces with roboticsVSAvoidprecise manipulation requirements
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The interconnect device performs self-alignment through its housing geometry and mating features, eliminating the need for complex external alignment procedures. The device automatically orients itself during the push-to-mate operation, allowing robotics to simply apply force along the connection axis without complex manipulation sequences.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The interconnect device separates the alignment function (housing geometry) from the connection function (electrical contacts). This segmentation allows the housing to guide alignment passively while the electrical connections are made automatically through the push-to-mate mechanism, reducing operational complexity.

Inventive Principle:
Principle #1Segmentation

2Reliability

If existing interconnect devices are used, then high-voltage connections can be made, but precise alignment of mating surfaces is required which increases time and complexity

Engineering Contradiction:
Improvehigh-voltage connection capabilityVSAvoidalignment time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The housing incorporates self-aligning features such as tapered surfaces, guide pins, or complementary geometric profiles that automatically orient the mating surfaces during approach. This eliminates time-consuming manual alignment procedures and allows rapid connection by simply pushing the connectors together along the alignment axis.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The housing geometry pre-establishes the alignment path and orientation before electrical contact is made. The physical structure of the housing guides the mating process, ensuring proper alignment is achieved automatically as the connectors approach each other, before the actual electrical connection occurs.

Inventive Principle:
Principle #10Preliminary action

3Reliability

If existing interconnect devices are used, then connections can be made, but risk of electrical shock and noise migration increases without suitable ground connection

Engineering Contradiction:
Improveconnection capabilityVSAvoidelectrical shock and noise risk
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The grounding path is merged with the housing structure itself rather than being a separate component. The housing material and structure serve dual purposes: providing mechanical support/alignment and establishing the electrical ground path. This integration ensures grounding is automatically established when the housing is properly mated, eliminating the risk of noise migration and electrical shock.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The housing acts as an intermediary that establishes the ground connection before electrical contacts are made. The housing material with appropriate electrical properties serves as the mediator that creates a safe reference potential, preventing voltage transients and noise from migrating through unintended paths during the connection process.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables secure, efficient, and safe high-voltage connections by facilitating self-alignment and grounding, reducing the risk of electrical accidents and noise interference, while allowing for reliable operation with robotics or remote manipulators.

Implementation Method 1

The insulator bushing of the electrical interconnect device is formed from a dielectric having a dielectric strength greater than a dielectric strength of air

Methodology Applied
Scientific EffectDielectric strength: Dielectric

Data Source

PatentUS11374346B2High-voltage push to mate electrical interconnect
Publication Date: 2022.06.28 BATTELLE SAVANNAH RIVER ALLIANCE LLC
  • US11374346B2 patent drawing
  • US11374346B2 patent drawing
  • US11374346B2 patent drawing

AI summary

A high-voltage self-aligning push to mate electrical interconnect device is provided. The electrical interconnect device includes a housing with a mating end and a receiving end. The interconnect also includes an insulator bushing configured to be affixed to the receiving end of the housing. The interconnect also includes a center pin disposed within the housing. The center pin extends from the mating end of the housing to the receiving end of the housing. The interconnect also includes a connector socket disposed within the insulator bushing and which is in electrical communication with the center pin. The interconnect also includes an alignment sleeve including a chamfered mating funnel defining a void configured to accept and surround the housing and at least a portion of insulator bushing.