High-Voltage T-Connector With Solid Insulation Field Control

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Solution Overview

Problem

Current solutions for connecting high voltage cables above 42 kV are inefficient and lack reliability, often requiring large gas insulated switchgear assemblies that are not maintenance-free.

Innovation Solution

A connector design featuring a metal conductor with an insulating layer moulded onto its ends and intermediate sections, accompanied by a semiconductive layer, which provides a controlled electric field distribution using specific distance configurations and materials like thermoplastics or thermosetting polymers, and is housed in a watertight enclosure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If gas insulated switchgear systems are used for high voltage cable connections, then voltage handling capability is improved, but device complexity and maintenance requirements increase

Engineering Contradiction:
Improvevoltage handling capabilityVSAvoidsystem complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the gas insulation system from high voltage cable connections, replacing it with a solid insulation layer made of thermoplastic or thermosetting material. This removes the complexity and maintenance requirements of gas insulated switchgear while maintaining the ability to handle high voltages through proper insulation design and electric field control.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent changes the insulation parameter from gas phase to solid phase material, and optimizes the geometric parameters of the conductor and insulation layer to control electric field distribution. This parameter transformation enables high voltage handling without requiring complex gas insulation systems.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If traditional connection methods are used for high voltage cables, then voltage isolation is improved, but manufacturing efficiency and installation speed decrease

Engineering Contradiction:
Improvevoltage isolationVSAvoidconnection efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The insulating layer is pre-moulded onto the conductor element in a single integrated body during manufacturing, rather than being assembled from separate pieces during installation. This preliminary action ensures proper voltage isolation is built-in from the start while significantly reducing installation time and improving connection efficiency.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent merges the insulating layer, semiconductive layer, and conductor element into a single integrated connector assembly. This combination ensures proper voltage isolation while eliminating multiple assembly steps, thereby improving manufacturing efficiency and installation speed.

Inventive Principle:
Principle #5Merging (Combining)

3Manufacturing precision

If insulating layers are moulded onto conductor elements, then manufacturing precision and connection reliability are improved, but manufacturing complexity increases

Engineering Contradiction:
Improveinsulation positioning accuracyVSAvoidmoulding process complexity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent segments the insulation system into distinct functional layers: an insulating layer, a semiconductive layer, and a conductor element. Each layer can be manufactured and positioned independently with precise control, ensuring proper insulation positioning while managing manufacturing complexity through modular construction.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies different material properties and thicknesses at different locations - the insulating layer has varying thickness and material composition in different regions to control electric field distribution. This local quality optimization ensures precise insulation positioning and reliable connections while managing manufacturing complexity through targeted material application.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The connector enables efficient and reliable connections for high voltage cables without the need for gas insulation, simplifying installation and maintenance while ensuring uniform electric field distribution and mechanical robustness.

Implementation Method 1

an insulating layer; the insulating layer is moulded onto the second end and the intermediate section of the first elongated conductor element

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Implementation Method 2

the semiconductive layer is provided outside of the insulating layer; wherein the first insulator distance is shorter than the first semiconductor distance

Methodology Applied
Scientific EffectElectric field distribution: Electric Field

Data Source

PatentUS20240233984A1Novel T-connector design for robust and versatile high voltage connections
Publication Date: 2024.07.11 NEXANS SA
  • US20240233984A1 patent drawing
  • US20240233984A1 patent drawing
  • US20240233984A1 patent drawing

AI summary

A connector (1) for high voltage cables has a metal conductor (11) having a first elongated conductor element having a first end (12a), a second end (12b) and an intermediate section (12c) between the first end (12a) and the second end (12b); an insulating layer (21); and a semiconductive layer (31). The insulating layer is moulded onto the second end (12b) and the intermediate section (12c) of the first elongated conductor element (12) and the insulating layer (21) is provided at a first insulator distance (DI1) from the first end (12a) of the first elongated conductor element (12). The semiconductive layer (31) is provided outside of the insulating layer (21) and the semiconductive layer (31) is provided at a first semiconductor distance (DS1) from the first end (12a) of the first elongated conductor element (12). The first insulator distance (DI1) is shorter than the first semiconductor distance (DS1). The insulating layer (21) is moulded as one single insulating body.