High Voltage Semiconductor Test System With Bent Tip Contact Fingers

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Solution Overview

Problem

Existing high voltage semiconductor test systems face issues such as low device throughput, device jams, and electrical arcing due to inadequate contact with sunken pads of semiconductor devices, which are exacerbated by the complexity and expense of spring-loaded pogo pin interfaces.

Innovation Solution

A high voltage test system featuring a docking plate assembly with conductive contact finger assemblies and terminal blocks, allowing for multiple semiconductor devices to be tested simultaneously, with elongated conductors having bent tips for improved contact and alignment, and nonconductive holders for spacing and isolation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If gravity feed handlers are used for high voltage testing, then device handling is simplified, but device throughput is low and device jams occur frequently

Engineering Contradiction:

Improvedevice throughputVSAvoiddevice jam frequency

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The test system is divided into multiple independent test sites (first test site, second test site, etc.) within a single docking plate assembly, allowing parallel testing of multiple devices simultaneously. This segmentation of the testing function into multiple stations increases overall throughput while maintaining reliable individual contact at each site.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention transitions from single-site sequential testing to multi-site parallel testing by adding spatial dimensionality to the test head design. Multiple test sites are arranged in different locations on the docking plate, enabling simultaneous testing across multiple devices and thereby increasing productivity without compromising reliability.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If spring-loaded pogo pin interfaces are used for electrical contact, then contact reliability is improved, but device complexity and maintenance difficulty increase

Engineering Contradiction:

Improveelectrical contact reliabilityVSAvoidinterface complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The complex spring-loaded pogo pin mechanism is extracted and replaced with a simpler conductive contact finger assembly. The contact fingers are held in position by a nonconductive holder with recesses, eliminating the need for spring-loaded mechanisms while maintaining reliable electrical contact through the conductive fingers that extend into contact with device pads.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The conductive contact finger assembly with nonconductive holder represents a simpler, more maintainable interface design compared to complex spring-loaded pogo pins. The contact fingers can be easily replaced if needed, and the overall structure is less prone to failure, reducing maintenance requirements and complexity.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Adaptability or versatility

If electrical interface is designed for RF testing, then RF test requirements are met, but high voltage testing hardware cannot be implemented

Engineering Contradiction:

Improvetest system adaptabilityVSAvoidhigh voltage test reliability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The docking plate assembly with conductive contact finger assemblies is designed to be universally applicable for high voltage testing across multiple devices. The structure provides reliable electrical contact for high voltage applications while the multi-site configuration enables versatile testing capabilities. The design separates the electrical contact function from RF-specific hardware requirements.

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Productivity

If single IC testing is implemented, then test accuracy is maintained, but device throughput remains low

Engineering Contradiction:

Improvedevice throughputVSAvoidtesting time per device

Core Design Contradiction:

ProductivityVSLoss of time

Solution Approach 1:

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

By implementing multiple test sites that can operate simultaneously, the system eliminates idle time between device tests. While one device is being tested at one site, another device can be tested at another site, creating continuous useful action and maximizing productivity without sacrificing test accuracy.

Inventive Principle:

Principle #20Continuity of useful action

Data Source

PatentUS20220341989A1High voltage semiconductor test system with multiple sites for use with a pick and place handler

Publication Date: 2022.10.27 SILICON LABORATORIES INC

AI summary

A test system for high voltage testing of semiconductor devices including at least one test socket and a docking plate assembly. Each test socket includes a socket enclosure for encompassing first and second contact finger assemblies, in which the socket enclosure may include a cover and alignment plate. At least one test socket is embedded within the docking plate assembly which is configured to mount between high voltage test head and a pick and place handler. The docking plate assembly and each test socket includes one or more site openings each for receiving a corresponding device under test (DUT) during a high voltage test procedure. Each contact finger assembly includes at least one contact finger configured as an elongated conductor with a bent tip for electrically interfacing a pad of the DUT.