High-Voltage Transistor Layout to Reduce Interface Charge Trapping
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Solution Overview
Problem
High-voltage fin-based transistors experience charge trapping at interfaces between dielectric regions and fin structures, leading to unstable performance and reduced operational lifetime due to increased surface area contact with dielectric layers.
Innovation Solution
Incorporating planar active regions instead of multiple fin structures to reduce the interface surface area between silicon-based active regions and oxide-based dielectric layers, thereby minimizing charge trapping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple fin structures are used to increase control over channel regions, then switching performance is improved, but interface surface area with dielectric layers increases leading to charge trapping
Solution Approach 1:
The invention segments the active region into multiple fins only where needed for channel control under the gate structure, while keeping the source and drain active regions as unified planar structures. This segmentation approach maintains the benefits of multiple fins for channel control while avoiding the charge trapping issues that would result from segmenting the entire active region including source and drain areas.
Solution Approach 2:
The invention applies different structural qualities to different regions: multiple fins are used locally under the gate where channel control is needed, while planar structures are used in the source and drain regions where charge trapping would be problematic. This local differentiation resolves the contradiction by applying the appropriate structure in each location.
2Duration of action of stationary object
If multiple fin structures are used to increase control over channel regions, then operational lifetime is reduced due to charge trapping, but using planar structures would improve lifetime
Solution Approach 1:
The invention segments the active region into multiple fins only where needed for channel control under the gate structure, while keeping the source and drain active regions as unified planar structures. This segmentation approach maintains the benefits of multiple fins for channel control while avoiding the charge trapping issues that would result from segmenting the entire active region including source and drain areas.
Solution Approach 2:
The invention applies different structural qualities to different regions: multiple fins are used locally under the gate where channel control is needed, while planar structures are used in the source and drain regions where charge trapping would be problematic. This local differentiation resolves the contradiction by applying the appropriate structure in each location.
3Object-generated harmful factors
If planar active regions are used to reduce interface surface area, then charge trapping is minimized, but control over channel region may be reduced
Solution Approach 1:
The invention segments the active region into multiple fins only where needed for channel control under the gate structure, while keeping the source and drain active regions as unified planar structures. This segmentation approach maintains the benefits of multiple fins for channel control while avoiding the charge trapping issues that would result from segmenting the entire active region including source and drain areas.
Solution Approach 2:
The invention applies different structural qualities to different regions: multiple fins are used locally under the gate where channel control is needed, while planar structures are used in the source and drain regions where charge trapping would be problematic. This local differentiation resolves the contradiction by applying the appropriate structure in each location.
Data Source
AI summary
A high-voltage transistor may include a planar active region for a first source/drain active region, a second source/drain active region, and/or a channel active region. The planar active region(s) are included instead of a plurality of fin active regions to reduce the amount of surface area of the active regions in the high-voltage transistor that is in contact with surrounding dielectric layers of the high-voltage transistor. In other words, the planar active region(s) reduce the interface surface area between the silicon-based active regions of the high-voltage transistor and the surrounding oxide-based dielectric layers. The reduced interface surface area may reduce the occurrence of charge trapping in the high-voltage transistor, which may result in increased performance stability for the high-voltage transistor and/or may provide increased operational lifetime of the high-voltage transistor.


