High-frequency Module Shield Electrode Via Capacitor Design
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Solution Overview
Problem
High-frequency modules face challenges in reducing size and design flexibility due to the need for space for in-plane electrodes and the risk of parasitic capacitance from shield electrodes, which degrades module performance.
Innovation Solution
A high-frequency module design that incorporates a multilayer substrate with a shield electrode covering the resin layer and side surface, allowing for a capacitor via electrode to be arranged closer to the shield electrode, reducing the size of capacitors and increasing design freedom by using interlayer-connection via conductors and multiple capacitor in-plane electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If in-plane electrodes are used to form capacitors inside the multilayer substrate, then capacitor functionality is achieved, but the size of the multilayer substrate increases
Solution Approach 1:
The patent transitions from forming capacitors using only in-plane electrodes (2D arrangement) to using via electrodes that extend in the stacking direction (3D arrangement). By utilizing the vertical dimension through via electrodes 506 and 506A that penetrate multiple insulator layers, the capacitor structure achieves the required capacitance functionality without requiring additional planar area on the substrate surface.
2Area of stationary object
If via electrodes are arranged close to the shield electrode, then space is saved, but parasitic capacitance is generated between the via electrode and shield electrode
Solution Approach 1:
The patent introduces a ground-connection via electrode 506A as an intermediary element between the signal via electrode 506 and the shield electrode 504. This ground-connection via electrode is positioned between the signal via electrode and the shield electrode to provide a reference potential, thereby preventing unwanted parasitic capacitance from forming between the signal via electrode and the shield electrode while allowing the signal via electrode to be positioned close to the shield electrode for compact design.
3Object-affected harmful factors
If the shield electrode is connected to ground through in-plane electrodes, then shielding effectiveness is improved, but ground capacitance is formed that degrades high-frequency characteristics
Solution Approach 1:
The patent improves the ground connection for the shield electrode by using via electrodes 506A that extend in the stacking direction to connect the shield electrode to ground-connection land electrodes, rather than relying solely on in-plane electrodes. This vertical connection path through multiple insulator layers provides effective grounding while minimizing the formation of unwanted ground capacitance that would degrade high-frequency characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the size of the high-frequency module, enhances capacitance values, and improves design accuracy and freedom, while minimizing noise interference.
Implementation Method 1
a first capacitor is defined by the shield electrode and the capacitor via electrode
Data Source
AI summary
A high-frequency module includes a multilayer substrate that includes an insulator layer and a wiring electrode, a component on one main surface of the multilayer substrate, a resin layer on the one main surface so as to cover the component, and a shield electrode covering at least a portion of a surface of the resin layer and at least a portion of a side surface of the multilayer substrate. The wiring electrode includes a capacitor via electrode that is spaced away from the shield electrode inside the multilayer substrate, and a first capacitor is defined by the shield electrode and the capacitor via electrode.