Highly integrated power module and electrical appliance
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Solution Overview
Problem
Current power devices for electronic control in air conditioners are discretely distributed, leading to large heat dissipation areas and high costs due to their separate arrangement, which necessitates an improvement in their configuration.
Innovation Solution
A highly integrated power module that combines a power factor correction component, a rectifier bridge, a compressor inverter, and a blower inverter on a common substrate, with the rectifier bridge positioned on one side of the power factor correction element, the compressor inverter on another side, and the blower inverter on a third side, facilitating efficient heat dissipation and compact integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If power devices are discretely distributed in different regions, then each device can be independently arranged and maintained, but the occupied area becomes large and heat dissipation efficiency decreases
Solution Approach 1:
The patent integrates multiple power devices (rectifier bridge, PFC element, compressor inverter, blower inverter) onto a single substrate, merging previously discrete components into a unified power module. This consolidation reduces the total occupied area while maintaining functional independence through separate mounting regions and thermal management zones on the substrate.
Solution Approach 2:
The patent transitions from a two-dimensional discrete layout to a three-dimensional integrated structure by stacking power devices vertically on the substrate. The rectifier bridge, PFC element, and inverters are arranged in different layers and positions, utilizing vertical space to reduce the horizontal footprint while maintaining adequate spacing for heat dissipation and maintenance access.
2Ease of repair
If power devices are discretely distributed, then each device can be independently maintained, but heat dissipation area increases and cost increases
Solution Approach 1:
Multiple power devices are combined on a single substrate with shared thermal management infrastructure. The common substrate provides unified heat dissipation pathways, reducing redundant thermal management components and improving overall heat dissipation efficiency while maintaining individual device accessibility for maintenance.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support for all power devices, establishes electrical connections between components, and acts as a thermal management platform with integrated heat dissipation structures. This multi-functionality reduces the need for separate maintenance access structures while improving thermal efficiency.
3Area of stationary object
If power devices are integrated on a common substrate, then occupied area is reduced and heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The integrated power module is segmented into distinct functional regions on the substrate: rectifier bridge mounting area, PFC element mounting area, compressor inverter area, and blower inverter area. Each region is designed with specific thermal management and electrical connection characteristics, allowing complex integration to be managed through modular zonation rather than monolithic design.
Solution Approach 2:
Different regions of the substrate are designed with locally optimized properties: specific thermal conductivity values, tailored electrical trace layouts, and customized mounting structures for each power device type. This local quality approach manages overall system complexity by allowing each component to have its optimal design rather than forcing a uniform design across the entire module.
4Productivity
If power devices are arranged compactly on substrate, then space is fully utilized and area is reduced, but heat dissipation may be affected
Solution Approach 1:
The power devices are arranged in a nested configuration where smaller components are positioned within the thermal management zones of larger components. The substrate incorporates layered heat dissipation structures where thermal pathways are nested within the device arrangement, allowing compact spatial utilization while maintaining effective heat extraction through concentric thermal management zones.
Solution Approach 2:
The patent resolves the space-heat dissipation contradiction by transitioning to three-dimensional heat dissipation structures. Thermal management features are stacked vertically within the substrate thickness, providing adequate heat dissipation pathways without increasing the horizontal footprint. Heat sinks and thermal vias are arranged in multiple layers to maintain compact form factor while ensuring effective thermal management.
Data Source
AI summary
A highly integrated power module and an air conditioner are provided. The module has a substrate. The module has a power factor correction element, a rectifier bridge, a compressor inverter and a blower inverter, which are arranged on the substrate. The rectifier bridge is arranged on a first side of the power factor correction element. The compressor inverter is arranged on a second side of the power factor correction element. The blower inverter is arranged on a third side of the compressor inverter. The rectifier bridge is electrically connected to the power factor correction element. The power factor correction element is electrically connected to the compressor inverter and the blower inverter.