Hinge Antenna Layout With Heat Spreader Integration in Foldables
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In foldable electronic devices, designing a thin and light system with maximized System-on-a-Chip (SoC) performance is challenging due to thermal management issues, particularly when a thermal cross spread (TCS) sheet is used as a thermal solution, as it complicates the placement and performance of antennas at the hinge area.
Innovation Solution
The integration of antennas within the heat spreading structure, such as a graphite sheet, or using a mandrel antenna in the hinge structure, which allows for flexible placement and reduced interference with the thermal cross spread, enabling improved antenna performance across various device modes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermal cross spread sheet is used as a thermal solution, then thermal management is improved, but antenna placement and performance at the hinge area becomes complicated
Solution Approach 1:
The patent combines the thermal cross spread sheet and the antenna into a single integrated structure. The antenna is embedded within the thermal cross spread sheet, allowing both thermal management and antenna functionality to coexist in the same component, thereby simplifying antenna placement while maintaining effective heat dissipation.
2Reliability
If the antenna is placed in the hinge area, then device performance is improved, but interference from the thermal cross spread increases
Solution Approach 1:
The patent applies local quality by creating a specific region within the thermal cross spread sheet where the antenna is embedded. This localized integration allows the antenna to benefit from the thermal management capabilities of the sheet while maintaining its electromagnetic performance through optimized positioning and design within that specific area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances antenna performance by minimizing interference from the thermal cross spread, maintaining thermal efficiency, and supporting multiple device modes without additional space or complexity, thus addressing the thermal management and antenna placement challenges in foldable devices.
Implementation Method 1
a heat spreading structure, where the heat spreading structure extends from the case through an area of the hinge arrangement to the lid
Data Source
AI summary
Examples relate to concepts for antenna arrangement and particular to an antenna for an electronic device. An electronic device comprises, a case, a lid and a heat spreading structure. Further, an electronic device comprises a hinge arrangement between the case and the lid. The hinge arrangement comprises at least one hinge structure connecting the lid to the case. Further, the electronic device comprises an antenna. The antenna is arranged in an area of the hinge arrangement. The heat spreading structure extends from the case through the area of the hinge arrangement to the lid.