Hinge Cover Segmentation for Foldable Device Thermal Management
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Solution Overview
Problem
Existing foldable electronic devices face challenges in effectively covering hinge assemblies while enhancing heat dissipation, as various hinge designs complicate the design and assembly of hinge covers and hinder efficient heat dissipation.
Innovation Solution
The electronic device incorporates a hinge cover with movably connected shell parts that extend and retract to cover the hinge assembly, featuring heat dissipation openings and channels to facilitate airflow, along with a heat dissipation fan and structure to improve thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If hinge covers are used to cover hinge assemblies, then the appearance of the electronic device is improved, but the design and assembly complexity increases
Solution Approach 1:
The hinge cover is divided into multiple shell parts that can be separately assembled. Each shell part corresponds to a specific hinge assembly, allowing independent design and assembly. The shell parts are connected through movable connections, enabling modular assembly that reduces overall complexity while maintaining aesthetic appearance.
2Shape
If hinge covers are used to cover hinge assemblies, then the appearance of the electronic device is improved, but the heat dissipation capacity deteriorates
Solution Approach 1:
The hinge cover incorporates heat dissipation openings and flow channels within its structure. These openings allow air to pass through the hinge cover, creating a porous-like structure that enables heat dissipation while maintaining the covering function. The flow channels guide airflow to efficiently carry heat away from internal components.
Solution Approach 2:
The hinge cover acts as an intermediary structure that simultaneously serves aesthetic and heat dissipation functions. By integrating flow channels and openings into the cover design, it mediates between the need for appearance protection and the requirement for thermal management, allowing both functions to coexist.
3Ease of manufacture
If traditional hinge cover designs are used, then assembly is simplified, but heat dissipation efficiency is reduced
Solution Approach 1:
The hinge cover is segmented into multiple shell parts with integrated flow channels. This segmentation allows each part to be manufactured and assembled independently, maintaining ease of assembly while incorporating heat dissipation features. The modular structure enables straightforward assembly procedures despite the added functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively enhances the heat dissipation capacity of foldable electronic devices by allowing airflow through the hinge cover's channels and openings, improving thermal management and simplifying assembly by eliminating the need for screw locks.
Implementation Method 1
The electronic device includes a heat dissipation fan. The heat dissipation fan is disposed in the inner space of the at least one of the bodies and suitable for providing a heat dissipation air flow
Implementation Method 2
The electronic device includes a heat dissipation structure. The heat dissipation structure is disposed in the inner space of the at least one of the bodies and located between the heat dissipation fan and the heat dissipation flow channel
Implementation Method 3
At least a part of the heat dissipation air flow flows along the heat dissipation structure and arrives at the heat dissipation flow channel
Data Source
AI summary
An electronic device including two bodies, at least one hinge assembly, and a hinge cover is provided. The two bodies are pivoted to each other through the hinge assembly. The hinge cover is connected between the two bodies and covers the hinge assembly. The hinge cover includes a plurality of shell parts, and the shell parts are movably connected to each other in sequence. The hinge cover has at least one first heat dissipation opening and at least one heat dissipation flow channel, and the at least one heat dissipation flow channel communicates the first heat dissipation opening and an inner space of at least one of the bodies.