Hinge FPCB Routing Structure for Bend and Moisture Protection

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The compact design of modern electronic devices makes it challenging to optimally arrange connectors and flexible printed circuit boards, increasing the risk of damage due to bending and moisture exposure.

Innovation Solution

The electronic device incorporates a hinge structure with sealing members and rib supports to minimize the difference in height between the sealing member and the connector, reducing bending stress on the flexible printed circuit board and preventing moisture ingress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the electronic device is designed with compact arrangement to reduce internal accommodating space, then the device thickness is reduced, but the flexible printed circuit board becomes more susceptible to damage due to difficult arrangement of connector and circuit board

Engineering Contradiction:
Improveinternal accommodating spaceVSAvoidflexible printed circuit board durability
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent introduces a rib structure that extends in the thickness direction (second direction) of the device, creating a three-dimensional arrangement. The through hole penetrates the rib in the thickness direction, allowing the flexible printed circuit board to pass through vertically rather than horizontally constrained by compact 2D space. This dimensional change enables proper routing of the circuit board while maintaining device thinness.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The rib structure acts as an intermediary element between the connector and the flexible printed circuit board. It provides a dedicated pathway (through hole) that mediates the connection, reducing direct bending stress on the circuit board by distributing mechanical stress across the rib structure. The sealing member further mediates between the through hole and circuit board to prevent moisture ingress.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If waterproof tape is used to wrap around electronic components for moisture protection, then waterproof function is improved, but the arrangement space for connector and flexible printed circuit board is further reduced

Engineering Contradiction:
Improvemoisture protectionVSAvoidarrangement complexity of connector and circuit board
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent segments the waterproofing function from the structural support function. Instead of using waterproof tape that would wrap around and constrain the arrangement of connectors and circuit boards, the design uses a rib structure with through holes that provides both mechanical support and designated pathways for circuit board routing. The sealing member is separately applied only at the through hole location, providing localized waterproofing without complicating the overall arrangement.

Inventive Principle:
Principle #1Segmentation

3Length of stationary object

If the flexible printed circuit board is routed through a compact space to connect housings, then device thickness is reduced, but bending stress on the circuit board increases

Engineering Contradiction:
Improvedevice thicknessVSAvoidflexible printed circuit board strength
Core Design Contradiction:
Length of stationary objectVSStrength

Solution Approach 1:

The rib structure provides beforehand cushioning by creating a dedicated through hole pathway that anticipates and protects the flexible printed circuit board from bending stress. The circuit board passes through the rib rather than being forced through compact horizontal space, which cushions it from excessive bending. The sealing member applied at the through hole provides additional protection and support at this critical stress point.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Data Source

PatentUS12058830B2Electronic device including structure for preventing fracture of flexible printed circuit board
Publication Date: 2024.08.06 SAMSUNG ELECTRONICS CO LTD
  • US12058830B2 patent drawing
  • US12058830B2 patent drawing
  • US12058830B2 patent drawing

AI summary

Provided is an electronic device including a first housing, a second housing, a flexible housing including a hinge structure, a first printed circuit board disposed in the first housing, a second printed circuit board disposed in the first housing, laminated on one surface of the first printed circuit board facing a second direction and including a connector on one surface facing the second direction, a flexible printed circuit board connected with the connector, extending from the second housing through the hinge structure to the first housing, a rib supporting the first printed circuit board, disposed between the first printed circuit board and a first surface, including a through hole through which part of the flexible printed circuit board passes, extending in the second direction from one end, and at least one sealing member sealing a space between the through hole and part of the flexible printed circuit board.