Flexible Display Hinge Structure for Deformable Heat Dissipation

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Solution Overview

Problem

There is a need for an electronic device with a structure that effectively dissipates heat generated during use, particularly in flexible displays that can change size, to maintain performance and prevent damage from heat concentration.

Innovation Solution

The electronic device incorporates a hinge structure with a first and second hinge plate, reinforced by separate reinforcing members, and a heat dissipation member that is deformable and spaced apart from the hinge plates, allowing heat to be dissipated between the housings while minimizing damage from external impacts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a flexible display is used to change display size, then adaptability is improved, but heat dissipation becomes more difficult

Engineering Contradiction:

Improvedisplay size changeabilityVSAvoidheat dissipation efficiency

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

The heat dissipation member is divided into multiple regions (first region, second region, third region) that can independently deform. The first and second regions are spaced apart from the hinge plates while the third region connects them, allowing each segment to respond independently to mechanical stress during folding while maintaining thermal conduction pathways.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heat dissipation member is designed to be deformable by movement of the hinge plates, transitioning from a rigid structure to a dynamic one that adapts its shape during device folding and unfolding. This dynamic deformation allows the heat dissipation member to accommodate the flexible display's movement while maintaining thermal conduction functionality.

Inventive Principle:

Principle #15Dynamics

2Strength

If reinforcing members are added to support the display, then strength is improved, but device complexity increases

Engineering Contradiction:

Improvedisplay support strengthVSAvoidstructure complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The heat dissipation member serves dual functions: it dissipates heat through its thermal conduction properties and provides structural reinforcement through its deformable support structure. By merging these two functions into a single component, the patent reduces the need for separate reinforcing elements and simplifies the overall device structure.

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If the heat dissipation member is made deformable to accommodate hinge movement, then adaptability is improved, but manufacturing precision becomes more difficult to control

Engineering Contradiction:

Improvedeformability for hinge movementVSAvoidspacing and deformation control

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

Different regions of the heat dissipation member have different mechanical properties and deformation characteristics. The first and second regions are designed with specific spacing from the hinge plates to provide localized support, while the third region connects these areas with controlled deformability. This local differentiation allows precise control over deformation behavior in specific areas while maintaining overall adaptability.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively dissipates heat across the device, reducing the risk of performance degradation and external impact damage, while maintaining a compact form factor.

Implementation Method 1

a first heat dissipation member including a first region interposed between the first reinforcing member and the surface of the first hinge plate, a second region interposed between the second reinforcing member and the surface of the second hinge plate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250208669A1Electronic device comprising structure for dissipating heat generated in electronic device

Publication Date: 2025.06.26 SAMSUNG ELECTRONICS CO LTD

AI summary

An electronic device is provided. The electronic device includes a hinge structure including a hinge bracket, a first hinge plate rotatable with respect to the hinge bracket, and, a second hinge plate distinct from the first hinge plate and rotatable with respect to the hinge bracket, a display disposed on the first hinge plate and the second hinge plate across the hinge structure, a plurality of reinforcement members, attached to the display, including a first reinforcement member facing a surface of the first hinge plate and spaced apart from the first hinge plate, and a second reinforcement member facing a surface of the second hinge plate and spaced apart from the second hinge plate, and a first heat dissipation member including a first region interposed between the first reinforcing member and the surface of the first hinge plate, a second region interposed between the second reinforcing member and the surface of the second hinge plate, and a third region connecting the first and the second region and being deformed by movement of the first hinge plate and the second hinge plate, wherein, in an unfolded state of the electronic device in which a direction in which the surface of the first hinge plate faces the same direction in which the surface of the second hinge plate faces, at least a portion of the third region passes through a gap between a side surface of the first hinge plate and a side surface of the second hinge plate, which face each other.