Heat Transfer Member Across Hinge for Foldable Device Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Foldable electronic devices face challenges in heat dissipation due to reduced exposed surface area when folded, leading to increased internal temperatures and uneven heat generation across different areas.
Innovation Solution
The implementation of a heat transfer member that extends across the hinge structure of the electronic device, featuring a first and second heat transfer area, a connecting area, and a heat transfer space, to efficiently transfer heat between the different areas of the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the electronic device is folded to reduce size, then the portability and compactness are improved, but the exposed surface area of the display is decreased leading to increased internal temperature
Solution Approach 1:
A heat transfer member is introduced as an intermediary component between the first and second spaces separated by the hinge structure. This heat transfer member includes a first heat transfer area in the first space, a second heat transfer area in the second space, and a connecting area that bridges them across the hinge, enabling thermal energy to move between the two separated regions.
2Ease of operation
If the electronic device is folded, then the portability is improved, but the heat dissipation efficiency is worsened due to reduced exposed surface area
Solution Approach 1:
The heat transfer member extends in the thickness direction (Z-axis) across the hinge structure, creating a three-dimensional heat transfer path. This vertical extension allows heat to be transferred between the first and second spaces even when the device is folded, compensating for the reduced exposed surface area on the front face.
3Adaptability or versatility
If the electronic device is divided into separate areas based on folding axis, then the flexibility and foldability are improved, but the heat distribution becomes uneven across different areas
Solution Approach 1:
The heat transfer member merges the thermal pathways of the first and second spaces by providing a connecting area that spans the hinge structure. This integration allows heat to be distributed more uniformly across both areas, preventing thermal isolation that would occur if the hinge completely separated the two regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective heat transfer and dissipation across the entire electronic device, even when in a folded state, thereby minimizing temperature differences between areas and maintaining optimal performance.
Implementation Method 1
a heat transfer member provided to extend from the first space to the second space through the hinge structure and perform a heat transfer between the first space and the second space
Data Source
AI summary
The electronic device includes a display including a first area and a second area, a first housing configured to support the first area and to form a first space, a second housing configured to support the second area and to form a second space, a hinge structure configured to foldably connect the first housing and the second housing based on a folding axis to be in a first state in which the first and second areas form substantially a same plane or in a second state in which the first and second areas face each other, and a heat transfer member provided to extend from the first space to the second space through the hinge structure and configured to perform a heat transfer between the first space and the second space.