Hinge Mechanism for Dynamic Airflow Gap in Foldable Electronic Devices
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Solution Overview
Problem
Electronic devices, such as notebook computers, face heat dissipation issues when their air inlets and outlets are covered, leading to temperature rises and reduced performance, especially when used on soft surfaces.
Innovation Solution
The design incorporates a hinge structure between two bodies of the device, allowing for unfolding that expands a gap for airflow, with a fan and elastic member to enhance heat dissipation, ensuring effective cooling in any usage state.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the air inlet and air outlet are located on the mainboard in conventional positions, then the device structure is simple, but the heat dissipation is ineffective when the device is placed on soft surfaces
Solution Approach 1:
The hinge structure enables dynamic adjustment of the first part's angle relative to the second part. When the device is placed on soft surfaces, the hinge allows the first part to tilt, preventing the air inlet and outlet from being covered, thus maintaining effective heat dissipation without requiring a completely redesigned static structure
Solution Approach 2:
The invention introduces a new spatial dimension by adding the hinge mechanism that enables angular movement between the first and second parts. This dimensional change allows the air inlet and outlet to maintain optimal positioning relative to the support surface, improving heat dissipation efficiency without complicating the basic structural layout
2Temperature
If the device is used on soft surfaces with conventional air inlet/outlet positioning, then the device is portable and easy to use, but the air inlet and outlet get covered leading to temperature rise
Solution Approach 1:
The hinge structure provides dynamic adaptability that automatically adjusts to different usage scenarios. Whether the device is placed on a hard or soft surface, the hinge allows the first part to orient itself optimally, ensuring continuous effective heat dissipation and maintaining usage comfort without manual intervention
3Temperature
If the hinge structure is added to enable angle adjustment, then the heat dissipation is improved in various positions, but the device complexity increases
Solution Approach 1:
The device is segmented into a first part and a second part connected by the hinge structure. This segmentation allows independent movement of the first part to optimize heat dissipation angles while keeping the second part stable, achieving improved thermal performance with minimal additional complexity
Solution Approach 2:
The hinge structure serves multiple functions: it enables angle adjustment for optimal heat dissipation, maintains structural integrity during movement, and adapts to various usage positions. This multi-functionality reduces the need for additional dedicated components, minimizing the overall complexity increase
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures effective heat dissipation and maintains the comfort and performance of the electronic device by allowing airflow through an expanding gap, even when the device is in various positions, preventing overheating.
Implementation Method 1
the hinge structure pushes against the first part to rotate the first part relative to the second part
Implementation Method 2
the fan is disposed in the first part and adapted to generate a heat dissipation airflow
Implementation Method 3
the elastic member is connected between the first part and the second part. When the second body is unfolded relative to the first body, the first part resists an elastic force of the elastic member and rotates relative to the second part
Data Source
AI summary
An electronic device includes a first body including a first part and a second part hinged to each other, a second body, and a hinge structure hinged between an edge of the second body and the second part. The first part has a recess. When the second body is unfolded relative to the first body from a folded state to a first unfolded state, the hinge structure pushes against the first part to rotate the first part relative to the second part. When the second body is continuously unfolded relative to the first body from the first unfolded state to a second unfolded state, the edge of the second body pushes against the first part, so that the first part continues to rotate relative to the second part. When the second body is in the folded state, the hinge structure is at least partially accommodated in the recess.