Hinge Heat Radiation Structure for Wearable Electronics
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Solution Overview
Problem
Wearable electronic devices, such as augmented reality glasses, face challenges in effectively dissipating heat generated by components like processors, leading to potential damage and user discomfort due to elevated temperatures, especially when a separate heat radiation structure is not easily integrated into the device's hinge mechanism.
Innovation Solution
Incorporating a hinge with a hole that serves as a heat sink, allowing heat from the processor to be radiated outside through the hinge, and using a conductive member to transfer heat efficiently from the processor to the hinge, which is then dissipated via air passing through the hole.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a separate heat radiation structure is added to the wearable electronic device, then heat radiation performance is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines the heat radiation function with the hinge structure by forming a heat radiation hole directly in the hinge. This integration eliminates the need for separate heat radiation components while maintaining effective heat dissipation, thereby improving heat radiation performance without increasing device complexity
Solution Approach 2:
The hinge is designed to serve multiple functions: it provides the mechanical connection between housing parts and simultaneously acts as a heat radiation structure through the incorporated heat radiation hole. This multi-functionality allows the hinge to fulfill both structural and thermal management roles without adding extra components
2Temperature
If a separate heat radiation structure is added to the wearable electronic device, then heat radiation performance is improved, but ease of manufacture deteriorates
Solution Approach 1:
By integrating the heat radiation hole into the hinge structure, the patent reduces the number of separate components that need to be manufactured and assembled. The heat radiation function is incorporated into an existing component (the hinge), simplifying the manufacturing process compared to adding a separate heat radiation structure
Solution Approach 2:
The hinge is designed to serve multiple functions: it provides the mechanical connection between housing parts and simultaneously acts as a heat radiation structure through the incorporated heat radiation hole. This multi-functionality allows the hinge to fulfill both structural and thermal management roles without adding extra components
3Device complexity
If no separate heat radiation structure is used, then device complexity is reduced, but temperature of components increases causing damage and user discomfort
Solution Approach 1:
The patent combines the heat radiation function with the hinge structure by forming a heat radiation hole directly in the hinge. This integration eliminates the need for separate heat radiation components while maintaining effective heat dissipation, thereby improving heat radiation performance without increasing device complexity
Solution Approach 2:
The hinge structure itself provides the heat radiation function through the incorporated hole, allowing the component to serve its own thermal management needs without requiring external heat radiation components. The hinge's own structure is utilized to radiate heat from the processor to the outside
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat radiation performance, preventing processor overheating and damage, while maintaining the device's functionality and user comfort by effectively transferring and dissipating heat generated from internal components.
Implementation Method 1
heat generated from a component (e.g., the processor) of the electronic device may be rapidly transferred to the hole included in the hinge through the conductive member that connects the component (e.g., the processor) of the electronic device and the hinge
Implementation Method 2
The hole included in the hinge (e.g., a connecting member) may serve as a heat sink that radiates heat to the outside
Implementation Method 3
heat generated from the processor outside the wearable electronic device through the hinge having the hole provided therein
Data Source
AI summary
A wearable electronic device according to various embodiments of the disclosure includes: a housing including a first housing part in which a processor is received and a second housing part in which a display is received, and a hinge connecting the first housing part and the second housing part and having a hole provided in an area in communication with an outside of the wearable electronic device. At least part of heat generated from the processor is radiated to the outside through the hinge having the hole formed therein.