Hinge Support Heat Dissipation for High-Power LED Folding Devices

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Solution Overview

Problem

Current heat-dissipation architectures are inadequate for efficiently managing the high heat produced by single high-power LEDs in light source modules of portable folding electronic devices, leading to local heat spots that cause optical defects and reduce LED service life.

Innovation Solution

A heat-dissipation structure utilizing a hinge support and heat-conducting device, where the heat-conducting device is mounted on the hinge support near the light source, enhancing heat dissipation through the stiffness of the hinge support and improved thermal transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If current heat-dissipation architecture is used, then device structure is simple, but heat dissipation efficiency is insufficient for high-power LEDs

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidheat-dissipation structure complexity

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The hinge support structure is designed to serve dual functions: providing mechanical support for the panel module and acting as a heat dissipation pathway for high-power LEDs. By integrating the heat-dissipation function into the existing hinge support, the patent avoids adding separate complex heat-dissipation components while effectively managing LED heat generation.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

A heat-conducting device is introduced as an intermediary component between the high-power LED and the hinge support. This heat-conducting device efficiently transfers heat from the LED to the hinge support, which then conducts heat away from the LED region, solving the heat dissipation problem without requiring direct modification of the LED or complex additional cooling systems.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Power

If high-power LED is used to reduce LED quantity, then light-emitting power is improved, but local heat spot is induced

Engineering Contradiction:

Improvelight-emitting powerVSAvoidlocal heat spot temperature

Core Design Contradiction:

PowerVSTemperature

Solution Approach 1:

The heat generation problem is separated from the light emission function. The high-power LED continues to provide high light-emitting power, while the heat dissipation function is extracted and handled by the dedicated heat-conducting device and hinge support structure. This separation allows the LED to operate at high power without suffering from its own heat generation issues.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The hinge support, which is a necessary structural component anyway, is converted into a beneficial heat dissipation pathway. By utilizing the hinge support's thermal conductivity and positioning the heat-conducting device to transfer heat to it, the structure that must exist for mechanical reasons is transformed into an active heat management solution.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Reliability

If heat-dissipation structure is added, then heat dissipation efficiency is improved, but device complexity increases

Engineering Contradiction:

ImproveLED service lifeVSAvoidheat-dissipation components

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The heat dissipation system is merged with the mechanical support structure. The hinge support, which must exist to connect the display panel to the housing, is combined with the heat dissipation function. This integration means that the same structural component serves both mechanical and thermal management purposes, avoiding the need for separate heat-dissipation components that would increase device complexity.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively dissipates heat produced by high-power LEDs, reducing the risk of optical defects and extending the service life of the light source by improving heat transfer efficiency and maintaining structural integrity.

Implementation Method 1

heat produced by the light source can be dissipated through the heat-conducting device

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8760864B2Heat-dissipation structure for a portable folding electronic apparatus

Publication Date: 2014.06.24 AU OPTRONICS CORP

AI summary

A heat-dissipation structure for a portable folding electronic apparatus includes a hinge support and a heat-conducting device. The portable folding electronic apparatus includes a first casing, a second casing, a hinge, a panel module, and the heat-dissipation structure. The first casing and the second casing are pivotally connected by the hinge. The panel module includes a frame and a light source disposed at a corner of the frame. The hinge support is connected to the hinge and the frame. The heat-conducting device is fixed on the hinge support near the light source. Therefore, heat produced by the light source can be dissipated through the heat-conducting device for improving the optical effect of the panel module; deformation of the heat-conducting device can be reduced by use of the stiffness of the hinge support.