Hinge Vent Structure for Angle-Adaptive Heat Dissipation

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Solution Overview

Problem

Existing electronic devices face challenges in effectively dissipating heat while minimizing the exposure of heat dissipation structures, which compromises miniaturization and aesthetic design.

Innovation Solution

Incorporating a hinge structure with integrated vent members that guide air flow directionally through intake and exhaust portions, allowing for efficient heat dissipation without increasing device size or compromising aesthetics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a separate vent structure is added for heat dissipation, then heat dissipation function is improved, but device size and structural complexity increase

Engineering Contradiction:
Improveheat dissipation functionVSAvoidstructural complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent combines the vent structure with the hinge structure by forming the vent members as integral parts of the hinge assembly. The first and second vent portions are formed on the hinge structure itself, eliminating the need for separate vent components and reducing overall structural complexity while maintaining effective heat dissipation functionality

Inventive Principle:
Principle #5Merging (Combining)

2Shape

If vent structure exposure is minimized, then aesthetic design is improved, but heat dissipation effectiveness may be compromised

Engineering Contradiction:
Improveaesthetic designVSAvoidheat dissipation effectiveness
Core Design Contradiction:
ShapeVSTemperature

Solution Approach 1:

The vent members are designed to rotate together with the hinge structure, dynamically adjusting the vent openings based on the device's folding angle. When the device is folded, the vent members orient openings away from external surfaces to maintain aesthetics; when unfolded, they optimize airflow paths to ensure effective heat dissipation

Inventive Principle:
Principle #15Dynamics

3Volume of moving object

If space inside the device is reduced, then miniaturization is improved, but heat dissipation capacity may be reduced

Engineering Contradiction:
Improvedevice miniaturizationVSAvoidheat dissipation capacity
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The vent members utilize the third dimension by rotating about the rotation axis to control airflow direction. This dimensional approach allows the system to manage heat dissipation effectively without requiring additional internal space, as the rotational mechanism directs existing airflow paths rather than requiring larger vent openings or additional components

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The hinge structure enables effective heat dissipation across various angles of use, minimizing space occupation and preventing air mixing, thus enhancing portability and aesthetic appeal.

Implementation Method 1

a fan component disposed in a first space inside the first housing, and a hinge structure rotatably connecting the first housing and the second housing about a rotation axis... including an intake portion configured to suck air into the first space from the outside and an exhaust portion configured to discharge air from the first space to the outside, according to an operation of the fan component

Methodology Applied
Scientific EffectAir circulation: Convection

Implementation Method 2

the hinge structure includes a vent member configured to rotate about the rotation axis, and in which a first vent portion for guiding air flow between the intake portion and the outside, and a second vent portion for guiding air flow between the exhaust portion and the outside are formed

Methodology Applied
Scientific EffectAir flow guidance: Convection

Data Source

PatentUS12405645B2Hinge structure with air vent and electronic device having the same
Publication Date: 2025.09.02 SAMSUNG ELECTRONICS CO LTD
  • US12405645B2 patent drawing
  • US12405645B2 patent drawing
  • US12405645B2 patent drawing

AI summary

An electronic device includes first and second housings rotatable relative to each other, a fan inside the housing, and a hinge structure rotatably connecting the first and second housings to each other. The hinge structure includes a vent member rotating together with rotation of the first and second housings. The vent member includes first and second portions which guide first air flow between intake and exhaust openings together with operation of the fan. The first and second housings which face each other define a first angle therebetween, the first and second housings which are maximally rotated define a second angle therebetween, and the first and second housings forming a third angle between the first angle and the second angle, rotates the vent member to dispose the first and second vent portions together guiding air flow in different directions, relative to the front side of the electronic device.