Hinged Rotating Cold Plate for Spill-Free TIM Replacement
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Solution Overview
Problem
Replacing thermal interface materials (TIMs) between electronic components and cold plates is a time-consuming task, especially for liquid-cooling systems, which often requires complete removal of cold plates, risking spillage and damage.
Innovation Solution
A cold plate assembly with a hinge mechanism that allows the cold plate to rotate away from the electronic circuit, enabling easy access for TIM installation, removal, and replacement without disassembling the system, while keeping liquid lines attached.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the cold plate is completely removed from the system for TIM replacement, then access to the TIM is improved, but the risk of spillage and damage increases
Solution Approach 1:
The cold plate assembly is divided into two separable parts: a stationary base that remains attached to the PCB and a movable cold plate that can be detached. This segmentation allows the cold plate to be pivoted away for TIM access while the base remains in place, eliminating spillage risks associated with complete removal.
Solution Approach 2:
The cold plate is made dynamically movable through a hinge mechanism, transitioning from a fixed position during operation to a pivoted-away position during maintenance. This dynamic capability enables easy TIM replacement without complete disassembly, improving operational ease while maintaining system integrity.
2Ease of operation
If the cold plate is completely removed for TIM replacement, then TIM access is improved, but system reassembly time increases
Solution Approach 1:
By segmenting the cold plate into a stationary base and a movable plate portion, the system enables partial disassembly where only the necessary component (cold plate) is removed while the base remains attached. This reduces reassembly time compared to complete system disassembly.
Solution Approach 2:
The hinge mechanism is pre-configured to allow the cold plate to pivot away easily, and the quick-connect liquid line interfaces are prepared in advance. This preliminary setup enables rapid TIM replacement without time-consuming reassembly procedures.
3Ease of operation
If the cold plate is completely removed for TIM replacement, then TIM access is improved, but liquid line disconnection complexity increases
Solution Approach 1:
The liquid line connections are segmented into quick-connect interfaces that separate cleanly when the cold plate pivots away. This allows TIM replacement without complex disconnection procedures, reducing both operational complexity and time requirements.
Solution Approach 2:
Quick-connect interfaces act as intermediaries between the liquid lines and the cold plate, enabling easy attachment and detachment. These intermediaries simplify the reconnection process after TIM replacement, reducing operational complexity.
4Ease of operation
If a hinge mechanism is added to enable cold plate rotation, then TIM replacement ease is improved, but device complexity increases
Solution Approach 1:
A hinge mechanism is introduced to create a dynamically movable joint between the base and cold plate. This simple mechanical element enables the cold plate to pivot away for TIM access while adding minimal complexity compared to the benefits gained in maintenance ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates efficient servicing and replacement of TIMs without spillage risks, reducing downtime and maintenance complexity.
Implementation Method 1
a cold plate having a heat transfer surface configured to transfer heat from the electronic circuit to a cooling medium
Data Source
AI summary
Described herein is a rotating cold plate assembly that includes a base configured to be mounted to a printed circuit board (PCB) to at least partially surround an electronic circuit disposed on the PCB. The cold plate assembly further includes a cold plate having a heat transfer surface configured to transfer heat from the electronic circuit to a cooling medium. The cold plate assembly also includes a hinge coupling the base and the cold plate. The hinge is configured to move the heat transfer surface into and away from thermal contact with the electronic circuit.