Hinged DIMM Heat Spreader Assembly for Tight-Spacing Cooling
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Solution Overview
Problem
The challenge of effectively dissipating heat from dynamic random access memory (DRAM) dual in-line memory modules (DIMMs) is exacerbated by their increased power consumption and reduced spacing, which complicates cooling solutions due to smaller air gaps between modules.
Innovation Solution
A cooling assembly featuring hinged heat spreaders with a spring element that applies pressure to DIMM semiconductor chip packages, enhancing thermal transfer through clamping and rotation, combined with a heat sink or liquid cooling systems to manage heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If DIMM power consumption is increased to improve performance, then processing capability is improved, but heat dissipation increases
Solution Approach 1:
The patent changes the thermal management parameters by transitioning from passive convection cooling to active compression cooling. The spring element applies compressive force to improve thermal contact between the heat spreader and chip packages, fundamentally changing the heat transfer parameters to achieve better thermal management at higher power consumption levels
Solution Approach 2:
The heat spreader acts as an intermediary component between the heat-generating chip packages and the heat sink. By compressing the heat spreader against the chip packages through the spring element, the patent creates an efficient thermal pathway that mediates heat transfer from the high-power chips to the cooling system
2Volume of moving object
If spacing between DIMMs is reduced to increase density, then space utilization is improved, but cooling efficiency deteriorates
Solution Approach 1:
The patent extracts the cooling function from the DIMM module itself by integrating a dedicated cooling assembly with heat spreaders and a heat sink. This extracted cooling system operates independently, allowing tight DIMM spacing without compromising cooling efficiency since each module has its own thermal management capability
Solution Approach 2:
The cooling assembly incorporates dynamic elements including a spring element that provides adaptive compression force. This dynamic mechanism ensures consistent thermal contact between the heat spreader and chip packages even as thermal expansion and contraction occur, maintaining cooling reliability in high-density configurations
3Strength
If compression force is increased to improve thermal contact, then heat transfer is improved, but mechanical stress on components increases
Solution Approach 1:
The patent employs a flexible spring element instead of rigid compression mechanisms. The spring provides the necessary compressive force for thermal contact while inherently accommodating mechanical tolerances and thermal expansion, distributing stress evenly without creating localized high-stress points on the chip packages
Solution Approach 2:
The spring element acts as a cushioning mechanism that预先 (in advance) absorbs and distributes compression forces. By using the spring's elastic properties, the system prevents excessive point loads from being applied to the chip packages while still maintaining sufficient contact pressure for effective heat transfer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces thermal resistance and enhances cooling efficiency by ensuring consistent contact and heat transfer from chip packages to the heat spreaders, even in tight spacing conditions, thereby improving overall cooling performance.
Implementation Method 1
A spring element applies a spring loading force that causes the heat spreaders to rotate about the hinge and press into the DIMM's semiconductor chip packages
Implementation Method 2
heat that is generated by the semiconductor chips within the semiconductor chip packages is transferred to the heat spreaders, which, in turn, is transferred to the heat sink
Implementation Method 3
transferred to the heat sink and then heat sink's ambient thereby removing heat from the system
Data Source
AI summary
An apparatus is described. The apparatus includes a cooling assembly. The cooling assembly includes a cooling mass; a first heat spreader; a second heat spreader; a spring element; and, hinge components to form a hinge that the first and second heat spreaders rotate about. The spring element to apply a force to the first and second heat spreaders that causes the first and second heat spreaders to rotate about the hinge toward a circuit board located between the first and second heat spreaders.