Hinged Heat Sink for Connector Thermal Management

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Solution Overview

Problem

Electronic connectors and receptacles generate heat due to transformative elements, which if not managed effectively, can lead to thermal runaway conditions, decreased performance, and potential catastrophic failures, including fire risks.

Innovation Solution

A hinged heat sink with thermally conductive fins and a conformable thermal interface material is integrated into the receptacle, providing a thermal path for heat dissipation from the connector to the ambient air, ensuring effective thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a fixed heat sink is integrated into the receptacle, then thermal management is improved, but accessibility for cable insertion and removal is worsened

Engineering Contradiction:

Improvethermal managementVSAvoidcable insertion and removal accessibility

Core Design Contradiction:

TemperatureVSEase of operation

Solution Approach 1:

The heat sink is designed with a hinged configuration that allows it to move between a closed position for thermal management and an open position for cable accessibility. This dynamic structure resolves the contradiction by enabling the heat sink to adapt its state based on operational requirements, providing both thermal protection and ease of operation at different times

Inventive Principle:

Principle #15Dynamics

2Loss of energy

If the heat sink is designed to provide effective thermal contact, then heat dissipation is improved, but the structural complexity increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidheat sink structure

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The heat sink incorporates a conformable thermal interface material that can deform to match the surface geometry of the connector. This flexible material ensures effective thermal contact across irregular surfaces without requiring complex mechanical adjustment mechanisms, thus improving heat dissipation while controlling structural complexity

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The hinged design allows the heat sink to dynamically adjust its position and contact pressure against the connector. When closed, the heat sink applies sufficient force through the conformable material to ensure optimal thermal contact, while the hinge mechanism itself remains relatively simple in structure

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively manages heat generated by transformative elements within electronic connectors and receptacles, preventing thermal runaway and ensuring operational safety and performance by dissipating heat efficiently.

Implementation Method 1

a thermal path is provided for a dissipation point on the outside of the electronic receptacle

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

providing a thermal path for heat dissipation from the connector to the ambient air

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS8911244B2Receptacle with heat management for electronic and optical systems

Publication Date: 2014.12.16 INTERNATIONAL BUSINESS MACHINE CORPORATION

AI summary

An apparatus that is a receptacle adapted for receiving a connector. The apparatus may further include a hinged heat sink included in the receptacle. The hinged heat sink adapted in an open position for insertion and removal of a cable. The hinged heat sink further adapted in a closed position to make thermal contact with a thermally active location of the connector wherein a thermal path is provided for a dissipation point on the outside of the electronic receptacle.