Hinged Laminated Body Thickness Reduction via Integrated IC Housing

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Solution Overview

Problem

Conventional hinged laminated bodies for items like passports are thick due to separate layers for hinges and electronic components, making them difficult to manufacture and integrate efficiently.

Innovation Solution

A hinged laminated body design where a hinge layer with a hinge section is laminated on an entire surface, combined with a non-hinge layer, featuring housing holes for the IC module and antenna, and a thickness adjustment layer to reduce thickness and facilitate easier manufacturing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a hinge layer is laminated onto a card-like medium having an electronic component, then the inlet can be bound into a booklet, but the overall thickness becomes large

Engineering Contradiction:

Improvebindability into bookletVSAvoidoverall thickness

Core Design Contradiction:

Ease of operationVSLength of moving object

Solution Approach 1:

The patent combines the hinge layer and non-hinge layer into a single integrated structure where the hinge layer is formed on the card-like medium and the non-hinge layer is laminated thereon, creating a unified component that serves both as a hinge mechanism and as a housing for electronic components, thereby reducing overall thickness while maintaining booklet bindability

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The IC module is housed within a housing hole formed in the hinge layer, effectively nesting the electronic component within the hinge structure itself. This nested arrangement eliminates the need for separate housing layers, reducing the overall thickness of the inlet while preserving all functional requirements

Inventive Principle:

Principle #7Nested doll (Nesting)

2Adaptability or versatility

If a hinge section is bound into the booklet, then the inlet can function as a data page, but manufacture becomes difficult compared to IC cards

Engineering Contradiction:

Improvefunctionality as data pageVSAvoidmanufacturing difficulty

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The inlet is segmented into distinct functional zones: a hinge layer with a hinge section for booklet binding and a non-hinge layer for housing electronic components. This segmentation allows each zone to be optimized independently - the hinge section can be formed by standard lamination processes while the IC module is mounted in the housing hole, simplifying the overall manufacturing process compared to creating a fully custom hinged structure

Inventive Principle:

Principle #1Segmentation

Data Source

PatentEP3901828A1Hinged laminated body, layout sheet for hinged laminated body, and manufacturing method for hinged laminated body

Publication Date: 2021.10.27 DAI NIPPON PRINTING CO LTD

Figure 1A~1B
Figure 2A~2B
Figure 3A

AI summary

A thin hinged laminated body and a layout sheet for the hinged laminated body are provided. A hinged laminated body 20, equipped with: an IC module 30 having an IC chip 32 capable of performing contactless communication; a hinge layer 41 having a hinge section 41a which can be bound into a booklet; a non-hinge layer 42 which is laminated onto the hinge layer 41 and does not have a hinge part, wherein the hinge layer 41 is disposed over the entire surface of the laminated body 20 having the hinge, the hinge layer 41 and the non-hinge layer 42 have a housing hole 47 penetrating across the two layers, and the IC module 30 is housed and held inside the housing hole 47.