High Interface Packing Nanolaminated Structures
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Solution Overview
Problem
There is a need for materials that combine high strength, toughness, and hardness with low density, which conventional homogeneous materials cannot achieve, as they typically exhibit tradeoffs between these properties.
Innovation Solution
The development of high interface packing (HIP) materials using multi-scalar topology optimization and lamination techniques, specifically through electrodeposition processes, to create nanolaminated structures with controlled interface density and topology, allowing for the production of engineered structural materials (ESM) with enhanced performance characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional homogeneous materials are used, then manufacturing simplicity is maintained, but strength and toughness cannot be improved without increasing density
Solution Approach 1:
The material is segmented into alternating layers of dissimilar materials (e.g., metal and ceramic, or different metal alloys) with layer thicknesses in the nanometer to micrometer range. This segmentation creates high interface packing density, where the interfaces between layers act as barriers to dislocation motion and crack propagation, thereby increasing yield strength and toughness without requiring increased bulk density
Solution Approach 2:
The invention uses composite materials consisting of alternating layers of dissimilar materials with different mechanical, thermal, or electrical properties. The composite structure leverages the advantages of each constituent material while the interfaces between layers provide additional strengthening mechanisms, achieving superior strength-to-density ratio compared to homogeneous materials
2Strength
If conventional homogeneous materials are used, then structural simplicity is maintained, but toughness cannot be improved without sacrificing other properties
Solution Approach 1:
The material is segmented into alternating layers of dissimilar materials (e.g., metal and ceramic, or different metal alloys) with layer thicknesses in the nanometer to micrometer range. This segmentation creates high interface packing density, where the interfaces between layers act as barriers to dislocation motion and crack propagation, thereby increasing yield strength and toughness without requiring increased bulk density
Solution Approach 2:
Different regions of the material (individual layers and interfaces) are given different properties through the selection of dissimilar materials. The interfaces between layers have distinct mechanical and microstructural characteristics that differ from the bulk materials, providing localized strengthening and toughening mechanisms throughout the structure
3Strength
If interface density is increased through lamination, then yield strength increases ten-fold, but manufacturing complexity increases
Solution Approach 1:
The mechanical lamination process (physically stacking and bonding separate layers) is replaced with an electrochemical deposition process. Electrodeposition allows for the in-situ formation of alternating layers of dissimilar materials directly on a substrate through controlled electrochemical reactions, enabling precise control of layer thickness and composition while simplifying the manufacturing process and reducing the need for complex alignment and bonding operations
Solution Approach 2:
The electrodeposition process utilizes changes in electrochemical parameters (current density, pulse duration, electrolyte composition, temperature) to control the deposition rate, layer thickness, and material composition. By modulating these parameters, the process can produce nanolaminated structures with high interface density and precise architectural control, achieving ten-fold increases in yield strength while maintaining manufacturing feasibility
4Weight of moving object
If void volume is increased to reduce density, then weight decreases, but structural integrity may be compromised
Solution Approach 1:
The invention uses composite materials consisting of alternating layers of dissimilar materials with different mechanical, thermal, or electrical properties. The composite structure leverages the advantages of each constituent material while the interfaces between layers provide additional strengthening mechanisms, achieving superior strength-to-density ratio compared to homogeneous materials
Solution Approach 2:
The material is segmented into alternating layers of dissimilar materials (e.g., metal and ceramic, or different metal alloys) with layer thicknesses in the nanometer to micrometer range. This segmentation creates high interface packing density, where the interfaces between layers act as barriers to dislocation motion and crack propagation, thereby increasing yield strength and toughness without requiring increased bulk density
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These materials exhibit a significant increase in yield strength and toughness while maintaining low density, surpassing the performance of conventional materials, with some achieving a ten-fold increase in yield strength and ten-fold increase in toughness compared to homogeneous alloys.
Implementation Method 1
electrodeposition processes, to create nanolaminated structures with controlled interface density and topology
Data Source
AI summary
The present disclosure provides articles comprising a laminate material having a void volume of at least 40%, having a lattice structure comprising a plurality of interconnected struts forming polyhedrons in a series that extends in three dimensions, or both, where the laminate materials have an interface density of at least 2.0 interfaces/micrometer (μm). Also described are methods for forming the same.