High Impedance Surface With Discrete Passives for Low-Frequency Noise
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Solution Overview
Problem
Conventional high impedance surfaces are bulky, heavy, and limited to high frequency ranges, failing to effectively cover the Megahertz frequency range where most digital noise spectral energy exists, necessitating a more compact and efficient solution.
Innovation Solution
The integration of discrete passives, including chip inductors and capacitors, connected via conducting pads and cores, forming a high impedance surface that realizes low-frequency stop bands in a lightweight, compact form, enabling a wide frequency range from MHz to GHz through high-density inductance and capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional high impedance surfaces use large unit cell structures to realize effective inductance and capacitance, then low-frequency stop bands can be achieved, but the device becomes bulky and heavy
Solution Approach 1:
The patent changes the physical parameters by using discrete passive components (chip inductors and capacitors) with specific inductance and capacitance values to achieve the required electrical characteristics without the bulky physical dimensions of conventional unit cells. This allows low-frequency stop bands to be realized in a compact form factor.
Solution Approach 2:
The discrete passive components are mounted on a substrate and interconnected through conducting pads and vias, creating a nested structure where multiple functional elements are integrated into a compact assembly. This nesting approach achieves complex electromagnetic functionality in a reduced volume and weight.
2Reliability
If conventional high impedance surfaces use large unit cell structures, then effective inductance and capacitance are realized, but the device occupies large area
Solution Approach 1:
By using discrete passive components with optimized inductance and capacitance values, the patent achieves the required electrical parameters in a compact footprint. The conducting pads and vias are designed to minimize area while maintaining effective electrical connections, thereby reducing the overall device area.
Solution Approach 2:
The patent transitions from a two-dimensional planar unit cell structure to a three-dimensional configuration by stacking discrete passive components and using vertical vias for interconnection. This dimensional change allows effective inductance and capacitance to be achieved without proportionally increasing the planar area.
3Reliability
If conventional high impedance surfaces are designed for low frequencies, then Megahertz range coverage is achieved, but the structure becomes thick
Solution Approach 1:
The discrete passive components are mounted on both sides of a thin substrate and interconnected through vias, creating a compact nested structure. This approach achieves low-frequency Megahertz range coverage without requiring thick metallic panels, as the electrical path length is optimized through the vertical interconnection scheme rather than increased panel thickness.
4Object-affected harmful factors
If conventional high impedance surfaces use large unit cells, then effective electromagnetic shielding is achieved, but the device is heavy and bulky
Solution Approach 1:
The patent uses discrete passive components with specifically selected inductance and capacitance values to create effective electromagnetic shielding at low frequencies. By optimizing these electrical parameters, the required shielding performance is achieved without the weight penalty of large conventional unit cells.
Solution Approach 2:
The patent replaces the mechanical approach of using large physical unit cell structures with an electrical approach using discrete passive components. This substitution achieves the same electromagnetic shielding effect through optimized electrical parameters rather than increased physical dimensions, thereby reducing weight.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides a compact, lightweight high impedance surface with a wide frequency stop band, effectively suppressing electromagnetic waves and allowing for conformal manufacturing suitable for aerospace applications, with flexible substrate and adjustable inductance/capacitance values for multi-band filtering.
Implementation Method 1
a plurality of chip inductors, where at least a portion of the chip inductors are connected to a second side of the first set of conducting pads
Implementation Method 2
a plurality of chip capacitors, where at least a portion of the chip capacitors are connected to a second side of the second set of conducting pads
Implementation Method 3
the first set of conducting pads and the second set of conducting pads are connected to each other by at least one via running through the core
Data Source
AI summary
In one or more embodiments, a high impedance surface (HIS) apparatus comprises a core; a first set of conducting pads, where a first side of the first set of conducting pads is connected to a first side of the core; and a second set of conducting pads, where a first side of the second set of conducting pads is connected to a second side of the core. The apparatus further comprises a plurality of chip inductors, where at least a portion of the chip inductors are connected to a second side of the first set of conducting pads; and a plurality of chip capacitors, where at least a portion of the chip capacitors are connected to a second side of the second set of conducting pads.