HMD Cooling Device Positioning for Weight Balance
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Solution Overview
Problem
Head-mounted displays face increased power consumption leading to elevated temperatures of electronic components, which can result in malfunctions or operation cessation, and existing cooling solutions, such as heat pipes or fans, often shift the center of gravity forward, increasing the load on the user.
Innovation Solution
A head-mounted display design featuring a circuit board with a cooling device, including a vapor chamber, heat sinks, and fans, positioned in the upper portion of the device main body to effectively dissipate heat while maintaining a balanced center of gravity and reducing user load.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling device is disposed in the front portion of the device main body, then the temperature of the electronic component is suppressed from rising, but the center of gravity of the device main body is positioned in front, increasing the load applied to the user
Solution Approach 1:
The cooling device is repositioned from the front portion to the upper portion of the device main body, changing the spatial dimension of placement. This dimensional shift moves the cooling device away from the optical axis, positioning it above the circuit board rather than in front of it, thereby redistributing weight more favorably along the vertical axis and reducing the forward load on the user's head.
Solution Approach 2:
By positioning the cooling device in the upper portion of the device main body, the design creates a counterbalancing effect where the weight distribution is optimized to reduce the forward torque. The cooling device's position acts as a counterweight arrangement that offsets the forward pull, improving overall balance and reducing the load applied to the user.
2Adaptability or versatility
If the number of functions or performance is increased, then the functionality of the head-mounted display is improved, but the power consumption increases, leading to excessive temperature rise of electronic components
Solution Approach 1:
The patent converts the harmful heat generated by high-power electronic components into a manageable thermal management challenge. By implementing a dedicated cooling device with vapor chambers and heat sinks directly coupled to the circuit board, the system efficiently dissipates the heat as a byproduct of high performance, allowing the head-mounted display to maintain enhanced functionality without suffering from excessive temperature rise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses excessive temperature rise in electronic components, preventing malfunctions and reducing the load on the user, thereby enhancing the reliability and comfort of the head-mounted display.
Implementation Method 1
a cooling device that is disposed facing the mounting surface in the upper portion of the device main body
Implementation Method 2
a cooling device that is disposed facing the mounting surface in the upper portion of the device main body
Data Source
AI summary
A head-mounted display includes a device main body, a mounting band that supports the device main body and is mounted on a user's head, a circuit board that is disposed in the upper portion of the device main body and has a mounting surface on which one or more electronic components are mounted, and a cooling device disposed facing the mounting surface in the upper portion of the device main body.