HMD Fan Airflow for Face-Side Heat Dissipation
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Solution Overview
Problem
Head-mounted display devices cause discomfort due to increased temperature and humidity between the user's face and the device, resulting from heat and moisture accumulation and waste heat generated by the device's operation.
Innovation Solution
Incorporating a fan between the control circuit board and the face side of the casing, which generates an airflow to dissipate heat through a heat dissipation hole, preventing heat transfer to the face and actively lowering temperature and humidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the head-mounted display device operates for a period of time, then the display function is maintained, but the temperature and humidity in the space between the user's face and the device increase, causing discomfort
Solution Approach 1:
The patent extracts heat and moisture from the enclosed space between the user's face and the device by introducing a fan to create air flow that carries these elements out through a discharge hole, thereby reducing temperature and humidity in the confined space
Solution Approach 2:
The patent employs pneumatic principles by using a fan to generate controlled air flow through the device housing, creating a ventilation system that actively removes heat and moisture accumulations from the space between the device and the user's face
2Loss of energy
If the fan is disposed between the control circuit board and the face side of the casing, then heat dissipation efficiency is improved, but the device structure becomes more complex
Solution Approach 1:
The patent merges the heat dissipation function with the existing device structure by integrating the fan into the housing and combining it with the control circuit board arrangement, creating a unified thermal management system that prevents heat transfer to the face side while maintaining structural coherence
Solution Approach 2:
The fan serves as an intermediary element that actively manages thermal energy transfer, positioned between the control circuit board (heat source) and the face side (sensitive area), creating a controlled air flow path that mediates heat dissipation without direct thermal contact
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the temperature and humidity on the user's face, enhancing wearing comfort by actively dissipating heat and improving heat transfer efficiency.
Implementation Method 1
The fan is configured to generate an air flow flowing from the face side toward the heat dissipation hole
Implementation Method 2
the fan is disposed between the control circuit board and the face side of the casing, and is configured to generate an air flow flowing from the face side toward the heat dissipation hole
Data Source
AI summary
A head-mounted display device includes a casing, a control circuit board and a fan. The casing has a heat dissipation hole, and a face side and an external side opposite each other. The control circuit board is disposed in the casing. The fan is disposed in the casing and located between the control circuit board and the face side of the casing, and is configured to generate an air flow flowing from the face side toward the heat dissipation hole.