HMDSO Interlayer Thin Film Encapsulation for Crack Resistance
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Solution Overview
Problem
The existing thin film encapsulation structures for flat panel display devices face challenges in manufacturing complexity and fragility, particularly due to the need for alternately stacking organic and inorganic layers, which can lead to cracks when exposed to stress, and the use of single inorganic layers lacks flexibility.
Innovation Solution
A thin film encapsulation structure is developed using a multi-layer configuration with silicon nitride or silicon oxide inorganic layers and hexamethyldisiloxane (HMDSO) layers, where the HMDSO layer is interposed between the inorganic layers and has a density gradient to absorb stress, allowing for formation in a single chamber and reducing the risk of cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If organic and inorganic layers are alternately stacked to form thin film encapsulation, then oxygen and water penetration is prevented, but the manufacturing process becomes complicated and time-consuming
Solution Approach 1:
The patent combines the deposition of organic and inorganic layers into a single chamber system, allowing both layer types to be deposited sequentially without moving the substrate between chambers. This merging of deposition processes maintains the protective multi-layer structure while eliminating the complex substrate transfer operations required by conventional separate chamber systems.
Solution Approach 2:
The single chamber is designed to perform multiple functions: it can deposit both organic layers (such as PMMA) and inorganic layers (such as silicon nitride or silicon oxide) using different deposition modes. This multi-functionality allows the chamber to replace what would traditionally require separate specialized chambers, simplifying the overall manufacturing system.
2Ease of manufacture
If only inorganic layers are used for thin film encapsulation, then manufacturing process is simplified, but the encapsulation becomes fragile and prone to cracking
Solution Approach 1:
The patent creates a composite encapsulation structure by depositing organic and inorganic layers in alternating sequence within a single chamber. The organic layers (such as PMMA) provide flexibility and stress absorption, while the inorganic layers (such as silicon nitride) provide barrier properties. This composite approach maintains manufacturing simplicity while significantly improving crack resistance compared to pure inorganic structures.
Solution Approach 2:
The organic layers deposited in the single chamber serve as flexible components within the encapsulation structure. These organic thin films can accommodate stress and deformation without cracking, providing the flexibility needed to prevent crack propagation while maintaining the protective function of the overall encapsulation structure.
3Manufacturing precision
If substrate is moved between chambers for depositing organic and inorganic layers, then layer deposition can be performed, but manufacturing time and operational complexity increase
Solution Approach 1:
The patent merges the deposition capabilities for both organic and inorganic layers into a single chamber system. The substrate remains stationary while the deposition process is switched between organic and inorganic material deposition modes. This eliminates the time-consuming substrate transfer operations between separate chambers while maintaining the quality of layer deposition through controlled switching of deposition parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the manufacturing process and enhances the encapsulation's flexibility and resistance to oxygen and water penetration while reducing the likelihood of cracks by using a single chamber deposition and stress-absorbing HMDSO layers.
Implementation Method 1
a hexamethyldisiloxane (HMDSO) layer interposed between the inorganic layers
Implementation Method 2
the inorganic layers and the HMDSO layer may be formed in a single chamber
Data Source
AI summary
Thin film encapsulation for a flat panel display device and a method of manufacturing the thin film encapsulation structure. The thin film encapsulation structure of the flat panel display device includes thin film layers covering a display unit formed on a substrate, wherein the thin film layers comprise a plurality of inorganic layers and a hexamethyldisiloxane (HMDSO) layer interposed between the inorganic layers. Accordingly, as multiple layers of the thin film encapsulation structure may be formed in a single chamber, the manufacturing process may be simplified, and also, as the HMDSO layer, which is flexible, absorbs stresses, a risk of cracks occurring may also be reduced.