Induction Hob Single-Sensor Cooling Air Temperature Monitoring
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Solution Overview
Problem
Conventional induction hobs require multiple temperature sensors for each inverter power supply device, leading to increased costs due to the complexity and expense of these sensors.
Innovation Solution
A single temperature sensing means is positioned in the cooling airflow generated by the fan after the heat sink, allowing it to monitor the temperature of the power components effectively and minimize costs by representing the temperature of the power components accurately.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple temperature sensors are used for each inverter power supply device, then the temperature monitoring precision is improved, but the device complexity and cost increase
Solution Approach 1:
The patent merges the temperature monitoring function from multiple individual sensors into a single temperature sensor that monitors the collective temperature of all power components through the shared heatsink and airflow path. This consolidation reduces the number of sensors while maintaining effective temperature monitoring capability.
Solution Approach 2:
The single temperature sensor positioned in the airflow path serves as a universal monitoring point for all power components. The sensor monitors the temperature of the airflow that has passed over all power components, making it a multi-functional monitoring solution that replaces multiple dedicated sensors.
2Reliability
If multiple temperature sensors are used for each inverter power supply device, then the reliability of temperature monitoring is improved, but the manufacturing cost increases
Solution Approach 1:
The patent combines multiple temperature monitoring functions into a single sensor implementation, reducing component count and manufacturing complexity. The single sensor is positioned to monitor the aggregated thermal state of all power components through the common cooling airflow path.
Solution Approach 2:
The patent uses the cooling airflow itself as a thermal copy or representative of the power component temperatures. By positioning the sensor in the airflow path, the sensor measures a thermal copy of the combined temperature state of all power components, eliminating the need for direct contact with each component.
3Device complexity
If a single temperature sensor is used in the cooling airflow, then the device complexity is reduced, but the measurement precision may be compromised
Solution Approach 1:
The cooling airflow acts as an intermediary medium between the power components and the temperature sensor. The airflow carries thermal information from all power components to the single sensor, enabling indirect but comprehensive temperature monitoring without requiring direct sensor contact with each component.
Solution Approach 2:
The patent replaces multiple mechanical temperature sensors with a single sensor that uses the existing cooling airflow as a thermal transmission medium. This substitution leverages the airflow's natural thermal convection to transfer temperature information, eliminating the need for multiple direct measurement points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures the safe operation and temperature monitoring of power components while reducing the number of temperature sensors needed, thereby minimizing costs and maintaining efficient operation.
Implementation Method 1
power components are in thermal relationship with said heat sink
Implementation Method 2
fan generates a flow of cooling air circulated along said heat sink
Implementation Method 3
temperature sensing means is disposed in the flow of cooling air generated by said fan
Data Source
Figure 1
Figure 2
Figure 3
AI summary
The cooktop (1) has a control device (9) for controlling inductors. The control device includes a single temperature sensor (16) arranged in a cooling air stream (C) generated by a fan (15), and arranged downstream of an end of a heat sink (14). A microcontroller (21) is arranged in the cooling air stream generated by the fan, and arranged downstream of the end of the heat sink, where power supply to power components of the control device is limited by the microcontroller according to the value of temperature measured by the temperature sensor.