Hockey Puck Embedded Electronics Layered Elastic Protection

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Solution Overview

Problem

Hockey pucks equipped with electronics face damage from mechanical stress, and the embedding methods fail to provide adequate protection against deformation and fatigue, while the proximity of transmitters to the ice surface hampers efficient signal reception due to ice's high dielectric constant.

Innovation Solution

A puck embedding electronics with a layered structure of elastic materials, featuring a carrier structure with a rigid shell and two elastic materials of varying stiffness to absorb and distribute mechanical energy, along with a method of assembling the components within a centrally located cavity to ensure firm yet flexible embedding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If electronics are firmly embedded in the puck to prevent deformation and displacement, then reliability of electronics is improved, but mechanical stress is transferred to the electronics causing damage and fatigue

Engineering Contradiction:
Improveelectronics protectionVSAvoidmechanical stress damage
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies beforehand cushioning by embedding the electronics carrier in a recess of the puck and filling the remaining space with elastic material. This elastic material acts as a cushion that absorbs mechanical stress before it reaches the electronics, protecting them from impact damage while maintaining their position. The carrier structure with rigid shell provides additional protection, creating a layered defense system against mechanical stress.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

2Strength

If a rigid embedding structure is used to protect electronics, then strength against deformation is improved, but the structure transfers all mechanical stress to the electronics

Engineering Contradiction:
Improveembedding rigidityVSAvoidmechanical stress transfer
Core Design Contradiction:
StrengthVSForce

Solution Approach 1:

The patent applies local quality by creating different structural zones: a rigid carrier shell locally protects the electronics from deformation, while the surrounding elastic material absorbs distributed mechanical stress. The recess in the puck provides a localized firm anchor, while the elastic filling material provides localized stress absorption. This combination allows the system to have both rigidity where needed and flexibility where needed.

Inventive Principle:
Principle #3Local quality

3Measurement precision

If transmitter is positioned close to the ice surface for tracking, then position tracking capability is improved, but signal reception efficiency deteriorates due to ice's high dielectric constant

Engineering Contradiction:
Improveposition trackingVSAvoidsignal absorption
Core Design Contradiction:
Measurement precisionVSLoss of energy

Solution Approach 1:

The patent applies the intermediary principle by positioning the transmitter in a recess that elevates it above the ice surface, using the puck material as an intermediary medium between the transmitter and the ice. This recess structure acts as a mediator that allows the transmitter to operate closer to the ice for tracking precision while maintaining sufficient distance to reduce signal absorption by the ice's high dielectric constant.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively protects electronic components from mechanical stress and enhances signal transmission by using a combination of rigid and elastic materials to absorb impact and manage energy transfer, while the transmitter configuration optimizes energy use and reduces interference.

Implementation Method 1

The embedding employs a layered structure of elastic materials inside the puck. Within the carrier structure, a first elastic material is provided in which a battery is embedded. The carrier structure is embedded in a second elastic material provided within the centrally located cavity.

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

a first elastic material is provided in which a battery is embedded. The carrier structure is embedded in a second elastic material provided within the centrally located cavity

Methodology Applied
Scientific EffectEnergy absorption: Damping

Data Source

PatentUS11458370B2Method for embedding electronics into a puck and puck having embedded electronics
Publication Date: 2022.10.04 KINEXON GMBH
  • US11458370B2 patent drawing
  • US11458370B2 patent drawing
  • US11458370B2 patent drawing

AI summary

A puck embedding at least one transmitter circuit, and a method for producing a puck embedding at least one transmitter circuit. To protect the electronics from displacement or damage, the puck employs a layered structure. The puck has a centrally located cavity, containing a carrier structure having a rigid shell, at least one transmitter circuit supported by the carrier structure, and a battery provided within the carrier structure. The battery is embedded in a first elastic material provided within the carrier structure. The carrier structure is embedded in a second elastic material provided within the centrally located cavity.