Hold-Down Tray Conveyor With Adjustable Rollers for Substrate Cleaning
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Solution Overview
Problem
The increased temperature requirements and higher flux content in lead-free soldering processes for electronic substrates demand more time and energy to meet cleanliness standards, and existing conveyor systems struggle to securely transport and retain electronic substrates during cleaning operations.
Innovation Solution
A conveyor system with a C-shaped frame, slotted openings, and roller assemblies that apply force to a top belt to secure product carriers, ensuring stable transport through cleaning modules, including pre-wash, wash, rinse, and dry stages, using a combination of belts and rollers to maintain substrate stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If lead-free soldering processes are used with higher flux content, then soldering temperature requirements increase, but cleaning time and energy requirements increase
Solution Approach 1:
The roller assemblies are made movable along the conveyor frame to dynamically adjust the holding force applied to product carriers. This allows the system to adapt to different cleaning conditions and substrate types, optimizing both cleaning effectiveness and throughput for lead-free flux residues
Solution Approach 2:
The system changes the parameter of holding force by allowing roller assemblies to move to different positions on the conveyor frame. This enables adjustment of the force applied to product carriers based on the specific cleaning requirements of lead-free flux residues, balancing cleaning thoroughness with processing time
2Temperature
If lead-free soldering processes are used with higher flux content, then soldering temperature requirements increase, but energy consumption increases
Solution Approach 1:
The dynamically adjustable roller assemblies enable the conveyor system to optimize energy consumption by applying only the necessary holding force for each cleaning cycle. This reduces wasted energy while maintaining effective cleaning of lead-free flux residues
Solution Approach 2:
By adjusting the position of roller assemblies on the conveyor frame, the system optimizes energy parameters by matching the holding force to the specific cleaning requirements, reducing overall energy consumption during the cleaning process
3Device complexity
If conventional conveyor systems are used, then substrate transport is simple, but substrate movement during cleaning cannot be prevented
Solution Approach 1:
The roller assemblies are designed to move along the conveyor frame to dynamically adjust and apply holding force to product carriers. This prevents substrate movement during cleaning while maintaining a relatively simple conveyor structure
Solution Approach 2:
The roller assemblies act as an intermediary mechanism between the conveyor system and product carriers, providing the necessary holding force to prevent substrate movement during cleaning without requiring complete redesign of the conveyor system
4Adaptability or versatility
If roller assemblies are made movable on the conveyor frame, then force application is adjustable, but device complexity increases
Solution Approach 1:
The conveyor system is segmented into modular roller assemblies that can independently move along the frame. This segmentation allows for adjustable force application while keeping each individual component relatively simple and manageable
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively secures electronic substrates during cleaning, reducing movement and disruption, and efficiently handles the harsh demands of lead-free soldering by ensuring consistent force application and secure retention throughout the cleaning process.
Implementation Method 1
Each guide rod may have a spring that is retained between the upper flange of the outer frame member and a body of the slide bolt, with the spring being configured to apply force on the slide bolt and the roller
Implementation Method 2
Each roller assembly is configured to engage the top belt to apply force on the top belt to secure the product carrier during transport along the conveyor system
Data Source
AI summary
A conveyor system is configured to transport the electronic substrates through the cleaning modules of a cleaning apparatus. The conveyor system includes a first outer frame member, a second outer frame member spaced from the first outer frame member, a bottom belt disposed between the first outer frame member and the second outer frame member, and a top belt spaced from the bottom belt. The bottom belt and the top belt are configured to receive a product carrier therebetween to transport electronic substrates along the conveyor system and through the cleaning modules. The conveyor system further includes a plurality of roller assemblies, with at least one roller assembly being coupled to the first outer frame member and at least one roller assembly being coupled to the second outer frame member. Each roller assembly is configured to apply a force on the top belt or the bottom belt.