Heat-Dissipation Holder Gel Structure for Cooling Electronic Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic device holders lack effective heat dissipation methods, leading to increased temperatures that reduce device performance and user experience.
Innovation Solution
A heat dissipation holder and protective case featuring a heat dissipation gel structure with ventilation channels, magnetic attraction, and flexible layers to secure and cool electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation methods (hollow ventilation, fan air cooling, semiconductor cooling fins) are used, then the holder can provide basic support and fixing functions, but the heat dissipation effect is insufficient for high-power electronic devices
Solution Approach 1:
The patent applies composite materials by combining heat dissipation gel with ventilation channel structures. The heat dissipation gel (containing phase change materials or heat conduction substances) is integrated into the holder body, creating a composite heat dissipation system that leverages both the gel's thermal properties and the ventilation's convective cooling, achieving superior heat dissipation compared to conventional single-method approaches
Solution Approach 2:
The patent utilizes phase transitions by incorporating phase change materials into the heat dissipation gel. These materials absorb excess heat from electronic devices during phase change (e.g., solid to liquid transition), providing active thermal regulation. This phase change mechanism enables the holder to effectively manage heat from high-power devices without requiring complex active cooling systems
2Reliability
If no heat dissipation措施 is taken, then the holder structure remains simple, but the temperature inside the holder rises, reducing electronic device performance
Solution Approach 1:
The patent uses heat dissipation gel as an intermediary substance between the electronic device and the external environment. The gel acts as a thermal mediator that conducts heat away from the device while the ventilation channels provide a pathway for heat dissipation to the surroundings. This intermediary system protects the electronic device from overheating, maintaining its reliability and performance
3Temperature
If heat dissipation gel structure is added to the holder, then heat dissipation effect improves, but the holder structure becomes more complex
Solution Approach 1:
The patent merges the heat dissipation gel structure with the holder body itself, rather than adding it as a separate component. The gel is integrated into the holder's internal structure, and the ventilation channels are formed as part of the holder's geometry. This merging approach achieves effective heat dissipation while minimizing additional structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces device temperature by 1-6°C, providing efficient heat dissipation and protection while ensuring secure positioning and user-friendly operation.
Implementation Method 1
A heat dissipation gel structure (30) is provided on the bottom plate (101)... One side of the heat dissipation gel structure is in contact with the electronic device...
Implementation Method 2
A ventilation channel (1012) is defined on at least part of the region of the bottom plate (101) on which the heat dissipation gel structure (30) is disposed... the other side thereof is communicated with ambiance through the ventilation channel
Implementation Method 3
a magnetic attraction member (103) connected to the connecting plate (1023)... The magnetic field of the magnetic attraction member (103) passes through the heat dissipation gel structure (30) to magnetically attract the electronic device (100)
Data Source
AI summary
A heat dissipation holder and a protective case for electronic equipment are provided. Both the heat dissipation holder and the protective case are provided with a heat dissipation gel structure. By providing a heat dissipation gel structure that not only contacts the electronic device but also communicates with outside air, a large and effective heat dissipation and temperature reduction of the electronic device can be achieved, and excellent heat dissipation and safety protection of the device can be realized.