Electronic Component Holding Tool With Adjustable Wire Guides
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Solution Overview
Problem
Existing holding tools for electronic components with winding assemblies face challenges in accurately positioning wires due to varying core diameters, leading to misalignment and increased waste products during manufacturing, especially when integrated with circular table manufacturing units where adjustments are difficult to perform before wire bonding.
Innovation Solution
The holding tool features movable wire guide means with rotatable shafts and cranks, allowing for precise adjustment of wire positions relative to the core diameter, and a coupling mechanism for automated alignment, enabling accurate wire placement and bonding over electronic circuit contact portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If wire guide pins are fixed at the jaws according to prior art, then the structure is simple, but the wire positioning precision deteriorates due to varying core diameters
Solution Approach 1:
The wire guide means are made movable relative to the holding tool body, allowing dynamic adjustment of wire guide positions to compensate for variations in core diameter. This enables precise wire positioning while maintaining a relatively simple overall structure.
Solution Approach 2:
The wire guide function is separated from the jaw assembly and implemented as independent movable wire guide means. This segmentation allows the wire guide position to be adjusted independently from the jaw clamping position, improving wire positioning precision without significantly increasing overall device complexity.
2Productivity
If wire guide pins are adjusted in subsequent positions after bonding, then the structure allows post-adjustment, but the manufacturing efficiency deteriorates due to iterative processes and waste products
Solution Approach 1:
The wire guide means are adjusted to the correct position before the wire bonding operation takes place. This preliminary adjustment ensures that wires are correctly positioned over contact portions before bonding, eliminating the need for iterative post-bonding adjustments and reducing waste products.
Solution Approach 2:
The system incorporates measurement and feedback mechanisms that allow the wire guide position to be adjusted based on actual core diameter measurements. This feedback loop ensures accurate wire positioning while maintaining high manufacturing efficiency by preventing defective products before they are created.
3Manufacturing precision
If wire guide means are positioned remote from jaws, then the wire positioning precision is improved, but the device complexity increases
Solution Approach 1:
The wire guide means are positioned remote from the jaws and made movable along the wire running direction. This dynamic positioning allows precise wire placement while keeping the structural complexity manageable through standardized movable components.
Solution Approach 2:
The movable wire guide means serve multiple functions: they guide the wire, compensate for core diameter variations, and can be adjusted for different wire positions. This multi-functionality improves wire placement precision without proportionally increasing device complexity.
Data Source
AI summary
A holding tool for fixing an electronic component (2) during a manufacturing process, said electronic component (2), comprising a winding assembly (20) and an electronic circuit (24), the holding tool (1) comprising a holding tool body (10), first an second jaws (12, 14) disposed at the holding tool body (10) relatively movable to each other in a first direction (A) and first and second wire guide means (3, 4) is characterized in that said first an second wire guide means (3, 4) are disposed at the holding tool body (10) remote from the jaws (12, 14).