Hollow Capillary Cooling Structure for 3D Chip Hot Spots
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Solution Overview
Problem
Existing cooling systems for semiconductor devices, particularly those with high performance computing and stacked three-dimensional chips, struggle to efficiently manage increased power density and heat generation due to limitations in coolant supply and vapor removal, leading to hot spots and inefficient heat exchange.
Innovation Solution
A semiconductor device employing a two-phase liquid cooling system with a capillary structure comprising microstructures that generate capillary forces to facilitate coolant flow, featuring interconnected first and second capillary channels, including hollow microstructures to enhance coolant supply and vapor removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling systems are used for high power density semiconductor devices, then the cooling system can manage basic heat generation, but the coolant supply is insufficient and vapor removal is inefficient, leading to hot spots
Solution Approach 1:
The cooling channel is divided into multiple segments with different functions: evaporation regions with microstructures for coolant supply, vapor removal regions, and condensation regions. This segmentation allows each region to optimize its specific function, improving overall cooling efficiency and preventing hot spots.
Solution Approach 2:
Hollow microstructures are nested within the cooling channel walls, creating capillary channels inside the channel structure itself. This nested design increases the coolant supply surface area and capacity without significantly increasing the overall device volume.
2Loss of energy
If conventional cooling systems are used for high power density semiconductor devices, then the cooling system can maintain basic operation, but vapor removal is inefficient leading to hot spots and energy consumption issues
Solution Approach 1:
The cooling system utilizes two-phase flow with phase transitions of the coolant. Evaporation occurs in heat-generating regions to absorb heat, and condensation occurs in dedicated regions to release heat. This phase change mechanism dramatically improves cooling efficiency and reduces energy consumption compared to single-phase cooling.
Solution Approach 2:
The capillary microstructures enable self-driven coolant flow without external pumps. The capillary force automatically supplies coolant to evaporation regions and facilitates vapor removal, reducing energy consumption while maintaining high cooling efficiency.
3Reliability
If hollow microstructures with interconnected capillary channels are implemented, then coolant supply and vapor removal are enhanced, but the device structure becomes more complex
Solution Approach 1:
The cooling channel incorporates porous or hollow microstructures that provide capillary channels. These porous elements enhance coolant supply and vapor removal capabilities while maintaining a relatively simple overall device structure, as the complexity is confined to the microscale features rather than the macroscopic device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The capillary structure enables rapid and even coolant supply, improved cooling capacity, and efficient heat exchange, reducing hot spots and energy consumption while allowing for a smaller coolant volume, thus enhancing cooling efficiency and reducing maintenance.
Implementation Method 1
a plurality of microstructures on an upper surface of the heat transfer member and configured to generate a capillary force to cause a flow of a coolant
Implementation Method 2
two-phase liquid cooling methods which involve a phase change of coolant
Implementation Method 3
a cooling channel thermally connected to the semiconductor chip and configured to accommodate a coolant which flows therein
Data Source
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AI summary
A semiconductor device includes: a semiconductor chip including a semiconductor integrated circuit; a heat transfer member covering an upper surface of the semiconductor chip; and a plurality of microstructures on an upper surface of the heat transfer member and configured to generate a capillary force to cause a flow of a coolant, wherein a first capillary channel is provided between adjacent microstructures of the plurality of microstructures, and each of the plurality of microstructures may include a hollow microstructure in which a second capillary channel is provided.