Hollow-Core Photonic Crystal Fiber Capillary Etching

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Solution Overview

Problem

Current broadband radiation sources for metrology applications in lithographic processes, such as those used in integrated circuit manufacturing, face limitations in precision and flexibility due to the inherent properties of existing hollow-core photonic crystal fibers, particularly in achieving uniform capillary wall thickness and efficient supercontinuum generation across the UV range.

Innovation Solution

A method for manufacturing hollow-core photonic crystal fibers involves chemically etching capillaries with a controlled etchant reactivity along their length, using a temperature gradient to achieve uniform or non-uniform wall thickness profiles, optimizing the capillary structure for improved broadband radiation generation and reduced resonance effects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional hollow-core photonic crystal fibers are used for broadband radiation generation, then the fiber structure is simple and easy to manufacture, but the capillary wall thickness is non-uniform causing resonance effects and limited spectral broadening

Engineering Contradiction:
Improvecapillary wall thickness uniformityVSAvoidetching process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies local quality by varying the etching conditions along the length of the capillary to create different wall thicknesses in different regions. The etching process is controlled to produce a first wall thickness in a first region and a second wall thickness in a second region, allowing each region to have optimized properties for specific functional requirements while maintaining overall structural integrity.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent utilizes parameter changes by controlling the etching process parameters (such as etchant concentration, exposure time, or temperature) to achieve desired wall thickness profiles. By adjusting these parameters spatially along the capillary length, the invention creates non-uniform wall thickness distributions that eliminate resonance effects and enhance spectral broadening capabilities.

Inventive Principle:
Principle #35Parameter changes

2Adaptability or versatility

If uniform wall thickness is achieved through conventional etching, then manufacturing is simpler, but resonance effects occur limiting broadband radiation generation

Engineering Contradiction:
Improvespectral broadening capabilityVSAvoidwall thickness control precision
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent applies local quality by varying the etching conditions along the length of the capillary to create different wall thicknesses in different regions. The etching process is controlled to produce a first wall thickness in a first region and a second wall thickness in a second region, allowing each region to have optimized properties for specific functional requirements while maintaining overall structural integrity.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent utilizes parameter changes by controlling the etching process parameters (such as etchant concentration, exposure time, or temperature) to achieve desired wall thickness profiles. By adjusting these parameters spatially along the capillary length, the invention creates non-uniform wall thickness distributions that eliminate resonance effects and enhance spectral broadening capabilities.

Inventive Principle:
Principle #35Parameter changes

3Adaptability or versatility

If the capillary wall is made thinner to reduce resonance, then spectral broadening improves, but mechanical stability decreases

Engineering Contradiction:
Improvesupercontinuum generation efficiencyVSAvoidcapillary mechanical stability
Core Design Contradiction:
Adaptability or versatilityVSStrength

Solution Approach 1:

The patent applies local quality by varying the etching conditions along the length of the capillary to create different wall thicknesses in different regions. The etching process is controlled to produce a first wall thickness in a first region and a second wall thickness in a second region, allowing each region to have optimized properties for specific functional requirements while maintaining overall structural integrity.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent utilizes parameter changes by controlling the etching process parameters (such as etchant concentration, exposure time, or temperature) to achieve desired wall thickness profiles. By adjusting these parameters spatially along the capillary length, the invention creates non-uniform wall thickness distributions that eliminate resonance effects and enhance spectral broadening capabilities.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the spectral broadening and coherence of the radiation output, improving the accuracy and flexibility of metrology tools by minimizing resonance impacts and maintaining mechanical stability, particularly in the UV range.

Implementation Method 1

chemically etching the capillary wall to reduce the wall thickness of the capillary wall

Methodology Applied
Scientific EffectChemical etching:

Implementation Method 2

using a temperature gradient to achieve uniform or non-uniform wall thickness profiles

Methodology Applied
Scientific EffectTemperature gradient: Temperature Gradient

Data Source

PatentUS12130468B2Method of manufacture of a capillary for a hollow-core photonic crystal fiber
Publication Date: 2024.10.29 ASML NETHERLANDS BV
  • US12130468B2 patent drawing
  • US12130468B2 patent drawing
  • US12130468B2 patent drawing

AI summary

A method for manufacturing a capillary usable as part of a hollow-core photonic crystal fiber. The method includes obtaining a capillary having capillary wall including a first wall thickness; and chemically etching the capillary wall to reduce the wall thickness of the capillary wall. During performance of the etching, a control parameter is locally varied along the length of the capillary, the control parameter relating to reactivity of an etchant used in the etching, so as to control the etched wall thickness of the capillary wall along the capillary length. Also disclosed is a capillary manufactured by such a method and various devices including such a capillary.