Hollow Cylindrical Conductive Inserts for Fine Pitch Assembly
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Solution Overview
Problem
The existing thermocompression insertion technique for assembling semiconductor components with small pitch interconnections faces challenges due to high insertion forces, which can cause destructive dislocations and are incompatible with the required assembly precision, and the production of solid inserts becomes difficult for very small pitches, limited by photolithographic resolution.
Innovation Solution
The use of hollow, beveled cylindrical conductive inserts with a zero-thickness skin, produced through thin layer deposition and engraving techniques, reduces the insertion force and maintains or increases the contact surface area by utilizing both external and internal surfaces for electrical contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If the section of the insert is reduced to limit insertion force, then the insertion force is reduced, but the number of connections is limited
Solution Approach 1:
The insert is segmented into a hollow cylindrical structure with an internal cavity, separating the external surface from the internal surface. This segmentation allows both surfaces to independently contribute to the contact area, effectively doubling the functional surface area while maintaining a small external section dimension to limit insertion force.
Solution Approach 2:
The invention transitions from a solid two-dimensional cross-section to a three-dimensional hollow structure. By utilizing the internal cavity space, the design adds a volumetric dimension that provides additional contact surface area without increasing the external footprint, thereby reducing insertion force while maintaining connectivity capacity.
2Force
If the section of the insert is reduced for finer interconnections, then the insertion force is reduced, but the manufacturing precision becomes difficult to achieve
Solution Approach 1:
The hollow insert structure functions as a thin-walled cylindrical shell where the wall thickness can be precisely controlled through thin film deposition techniques. This approach allows manufacturing of very fine inserts with precise dimensions that would be difficult to achieve through conventional solid insert fabrication, as the hollow structure can be formed by depositing thin conformal layers around a mandrel or through selective area growth.
3Area of stationary object
If conventional solid inserts are used, then the contact surface is sufficient, but the insertion force becomes excessively high
Solution Approach 1:
The hollow insert structure creates an effective porous or multi-surface configuration where the internal cavity provides additional contact interface. This allows the contact surface area to be distributed across both external and internal surfaces, increasing the total contact area while the hollow structure reduces the material volume and insertion resistance, thereby reducing insertion force.
4Productivity
If the number of connections increases, then the connectivity is improved, but the insertion force increases proportionally
Solution Approach 1:
Each insert is segmented into a hollow structure that provides dual surfaces for contact. This segmentation allows the contact function to be distributed across multiple surfaces (external and internal), enabling each connection point to achieve sufficient contact area with reduced individual insert size, thereby allowing more connections without proportionally increasing total insertion force.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces insertion forces, allows for more connections per unit force, and avoids air pocket formation during hybridization, enabling precise and efficient assembly of components with very fine interconnection pitches without the need for complex machinery.
Implementation Method 1
the first technique of thermocompression consists in pressing, in temperature, two balls one on the other so as to bind them by plastic deformation
Implementation Method 2
deposition of the material(s) constituting the inserts along the surface of the layer
Implementation Method 3
deposition of the material(s) constituting the inserts along the surface of the layer, with a view to simultaneously forming the body and the base of the inserts; elimination of the material or materials on the upper plane of the layer
Implementation Method 4
production, in the layer, of cylindrical openings adapted to the shape of the inserts; the component being inclined in a defined orientation, during the deposition of the material(s) constituting the inserts or during its elimination, so as to produce inserts having a bevelled free end
Data Source
Figure 1A~2
Figure 3~4D
Figure 5A~6
AI summary
The invention relates to a method for making a connection component (2) that comprises a set of conducting inserts (1) to be electrically connected with another component, said inserts (1) being hollow.