Hollow Heat Dissipation Substrate for Low-Resistance Power Modules
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Solution Overview
Problem
Conventional heat dissipation substrates for power semiconductor modules face issues such as increased thermal resistance and separation/bending due to adhesive layers and differences in thermal expansion coefficients, leading to reduced heat dissipation performance and potential module malfunction.
Innovation Solution
A heat dissipation substrate with a metal plate having a hollow structure is integrated through a hot press process in a high-temperature, high-pressure vacuum environment, eliminating the need for adhesive layers and ensuring uniform thermal expansion coefficients, thereby enhancing heat transfer efficiency and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive layers are used to bond heat dissipation components, then assembly is simplified, but thermal resistance increases and heat dissipation performance deteriorates
Solution Approach 1:
The patent removes the adhesive layer from the bonding process between the heat dissipation substrate and the vapor chamber. By eliminating this intermediate layer, direct thermal contact is achieved between the metal plates, removing the thermal resistance barrier while maintaining assembly simplicity through the hot press bonding process.
Solution Approach 2:
The patent introduces a hot press bonding process as an intermediary method to achieve direct metal-to-metal bonding without adhesive layers. The hot press process enables controlled bonding under high temperature and pressure, creating strong thermal contact while eliminating the need for adhesive materials that impede heat transfer.
2Ease of manufacture
If adhesive layers are used to bond components, then joining is easier, but component separation and bending occur due to thermal expansion differences
Solution Approach 1:
The patent removes the adhesive layer that acts as a weak link between components with different thermal expansion coefficients. By eliminating this intermediate material, direct bonding between metal plates is achieved, ensuring that all components expand and contract uniformly as a single integrated structure, preventing separation and bending.
Solution Approach 2:
The patent achieves homogeneous thermal expansion behavior by bonding metal plates with identical or matched thermal expansion properties directly together without adhesive layers. This homogeneity ensures uniform expansion and contraction across the entire heat dissipation substrate during temperature cycles, preventing structural instability.
3Ease of manufacture
If conventional bonding methods are used, then manufacturing is simpler, but heat transfer paths are longer and heat dissipation efficiency is reduced
Solution Approach 1:
The patent eliminates adhesive layers and intermediate bonding materials that extend heat transfer paths. By removing these thermal barriers, the heat transfer path becomes a direct metal-to-metal contact, significantly reducing thermal resistance and improving heat dissipation speed while maintaining manufacturing simplicity through hot press bonding.
4Adaptability or versatility
If separate bonding processes are used for heat dissipation components, then manufacturing flexibility is maintained, but manufacturing complexity and time increase
Solution Approach 1:
The patent merges multiple separate bonding operations into a single hot press bonding process. All metal plates are bonded simultaneously in one step under controlled temperature and pressure, eliminating the need for sequential bonding operations and reducing manufacturing complexity while maintaining flexibility for different component configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated substrate significantly improves heat dissipation performance by shortening heat transfer paths and preventing component separation, ensuring efficient vaporization of working fluids and maintaining module reliability.
Implementation Method 1
A heat dissipation substrate with a metal plate having a hollow structure is integrated through a hot press process in a high-temperature, high-pressure vacuum environment, eliminating the need for adhesive layers
Implementation Method 2
ensuring efficient vaporization of working fluids and maintaining module reliability
Implementation Method 3
The integrated substrate significantly improves heat dissipation performance by shortening heat transfer paths
Data Source
AI summary
The embodiment relates to a heat dissipation substrate for a power semiconductor module, a power semiconductor module including the same, a power converter including the same, and a method of manufacturing the same. A heat dissipation substrate for a power semiconductor module includes an insulating substrate (410), an intermediate metal plate (420) bonded on a bottom surface of the insulating substrate (410); a second metal plate (422) bonded on a bottom surface of the intermediate metal plate (420); and a first metal plate (421) bonded on a bottom surface of the second metal plate (422). The second metal plate (422) includes a hollow structure (HE).