Hollow MEMS Packaging System Reducing Cost and Signal Noise
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Solution Overview
Problem
The high cost and noise-related issues in existing MEMS packaging technologies hinder the integration of micro-electromechanical systems into cost-sensitive markets like cell phones, as packaging accounts for 30 to 70% of the device cost and introduces impedance mismatches leading to noisy signals.
Innovation Solution
A packaging system that forms terminal leads, configures a cavity by connecting the leads with a compound, attaches an integrated circuit or micro-electromechanical system, and bonds a cover to enclose the cavity, reducing manufacturing steps and costs while minimizing electrical interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional MEMS packaging methods are used, then the package provides necessary protection and cavity for MEMS movement, but the packaging cost becomes 30 to 70% of the overall device cost
Solution Approach 1:
The patent merges the package substrate and cover into a single integrated component formed from a single piece of material. This eliminates the need for separate bonding processes and reduces the number of parts, thereby lowering packaging cost while maintaining the necessary cavity structure for MEMS movement and protection.
Solution Approach 2:
The integrated package structure serves multiple functions simultaneously: it provides mechanical protection, creates the necessary cavity for MEMS movement, and establishes electrical connections through embedded terminals. This multi-functionality reduces the need for additional components and processes, reducing overall packaging cost.
2Reliability
If traditional packaging with bonding and wiring is used, then electrical connections are established, but impedance mismatches result in noisy or low amplitude signals
Solution Approach 1:
The patent extracts the electrical connection function from separate bonding and wiring processes and integrates it directly into the package substrate structure. Terminals are embedded within the substrate material itself, eliminating the need for additional bonding wires and connection layers that cause impedance mismatches and signal noise.
Solution Approach 2:
The package substrate acts as an intermediary that directly couples the MEMS device to the external circuitry through embedded terminals. This integrated connection path eliminates intermediate bonding layers and wiring structures that typically cause impedance mismatches, thereby reducing signal noise while maintaining reliable electrical connections.
Data Source
AI summary
A packaging system comprising: forming terminal leads; configuring a cavity by partially encapsulating the terminal leads with a compound; attaching an integrated circuit device, a micro-electromechanical system, a micro-mechanical system, or a combination thereof in the cavity; and bonding a cover to the terminal leads for enclosing the cavity.