Hollow Microballoon Resin for CMP Pad Durability
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Solution Overview
Problem
Existing hollow microballoons used in CMP polishing pads and other applications face challenges with durability and handleability, particularly when encapsulating heat storage materials, as they tend to have poor mechanical characteristics and production limitations.
Innovation Solution
A hollow microballoon is produced using a resin polymerized from a composition containing a cyclic molecule with at least three side chains and a polymerizable functional group, and a polymerizable monomer with similar characteristics, which enhances durability and handleability by improving mechanical and elastic recovery properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If polyrotaxane is incorporated in polyurethane(urea) to improve durability, then durability is improved, but handleability deteriorates due to high molecular weight and poor processability
Solution Approach 1:
The invention changes the molecular structure parameter by using a cyclic molecule with at least three side chains having polymerizable functional groups instead of linear polyrotaxane. This structural parameter change maintains the durability-improving crosslinking capability while improving handleability through better processability of the cyclic monomer composition.
Solution Approach 2:
The invention uses a cyclic molecule that can be easily polymerized and crosslinked to form the hollow microballoon structure, replacing the need for pre-formed polyrotaxane. This approach uses simpler, more processable starting materials that achieve the same durability effect through in-situ crosslinking.
2Stability of the object's composition
If inorganic particles are dusted on hollow microballoon surfaces to improve dispersibility, then dispersibility is improved, but wafer defects occur due to particle contamination
Solution Approach 1:
The invention extracts and removes the inorganic particles from the hollow microballoon structure. Instead of coating particles on the surface, the invention uses a pure polyurethane(urea) resin composition that inherently provides good dispersibility through its chemical structure and compatibility, eliminating the source of wafer defects.
Solution Approach 2:
The invention creates a composite resin system by combining polyurethane and polyurea in specific ratios, achieving both improved dispersibility and elimination of particle contamination. This composite approach allows optimization of rheological properties without introducing harmful inorganic particles.
3Adaptability or versatility
If hollow microballoon with high elasticity is used to achieve good compatibility with polyurethane(urea) resin, then compatibility is improved, but durability needs further improvement for micronized semiconductor interconnections
Solution Approach 1:
The invention merges polyurethane and polyurea resins in a specific composition ratio within the hollow microballoon structure. This combination allows the polyurethane component to provide compatibility with the polishing pad matrix while the polyurea component enhances durability through its higher strength and wear resistance properties.
Solution Approach 2:
The invention changes the compositional parameters by controlling the ratio of polyurethane to polyurea resin and adjusting the molecular weight distribution. This parameter optimization achieves both high elasticity for compatibility and sufficient durability for micronized interconnection polishing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a hollow microballoon with excellent durability and polishing characteristics, reducing wafer defects and enabling high polishing rates, while also being suitable for various applications beyond CMP polishing pads.
Implementation Method 1
a hollow microballoon including a resin produced by polymerizing a polymerizable composition that contains a cyclic molecule having at least three side chains with a polymerizable functional group introduced into the terminal thereof
Data Source
AI summary
The hollow microballoon of the invention includes a resin produced by polymerizing a polymerizing composition that contains a cyclic molecule having at least three side chains with a polymerizable functional group introduced into the terminal thereof and a polymerizable monomer other than the cyclic molecule having at least three side chains with a polymerizable functional group introduced into the terminal thereof. According to the invention, there are provided hollow microballoon capable of imparting not only polishing characteristics but also excellent durability to a CMP polishing pad using the hollow microballoon.