Hollow-Particle Coating Agent for Module Heat Insulation and Adhesion
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Solution Overview
Problem
Existing electronic component modules do not adequately enhance heat insulating properties, particularly with the use of hollow particles, and face issues with remelting and thermal deterioration due to heat during manufacturing processes.
Innovation Solution
A coating agent comprising a thermoplastic resin, a solvent that dissolves the resin, and hollow particles, with specific weight ratios and properties, is used to form a coating film that covers conductive adhesive portions in electronic component modules, enhancing heat insulating properties and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If hollow particles are used to enhance heat insulating properties, then heat insulation improves, but coating film uniformity and adhesion deteriorate
Solution Approach 1:
The patent optimizes the content ratio of hollow particles to thermoplastic resin within specific ranges (5-50 parts by weight of hollow particles per 100 parts by weight of thermoplastic resin, and thermoplastic resin content of 2-50 wt%). This parameter optimization ensures sufficient heat insulation while maintaining coating film uniformity and adhesion by balancing the insulating hollow particles with the binding resin matrix.
Solution Approach 2:
The coating agent uses a composite formulation combining hollow particles with thermoplastic resin in optimized proportions. This composite approach allows the hollow particles to provide heat insulation while the thermoplastic resin ensures coating film continuity, uniformity, and adhesion to the conductive adhesive portion.
2Temperature
If hollow particles are used to enhance heat insulating properties, then heat insulation improves, but coating film adhesion deteriorates
Solution Approach 1:
The patent specifies optimized content ranges for hollow particles (5-50 parts by weight per 100 parts by weight of thermoplastic resin) and thermoplastic resin (2-50 wt% of total coating agent). These parameter controls ensure that sufficient hollow particles provide heat insulation while adequate thermoplastic resin maintains coating film adhesion to the conductive adhesive portion.
Solution Approach 2:
The composite coating formulation balances hollow particles for heat insulation with thermoplastic resin for adhesion. The optimized ratio creates a synergistic effect where hollow particles provide thermal insulation and thermoplastic resin ensures proper coating film formation and bonding to the substrate.
3Reliability
If lead-free solder is used to cope with environmental problems, then environmental compliance improves, but whisker growth causing short-circuits worsens
Solution Approach 1:
The patent applies hollow particle-containing coating material on the lead-free solder surface to convert the harmful whisker growth issue into a manageable problem. The coating film physically covers the solder surface, preventing whisker formation and potential short-circuits while maintaining the environmental benefits of lead-free solder.
Solution Approach 2:
The coating agent is applied in advance to the conductive adhesive portion (lead-free solder) to prevent future harmful effects. The hollow particle-containing coating forms a protective barrier before whisker growth can occur, preemptively blocking the potential short-circuit pathway.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The coating agent forms a coating film with high heat insulating properties, preventing remelting of conductive adhesive portions and thermal deterioration of circuit boards during manufacturing, thereby improving the reliability and durability of electronic component modules.
Implementation Method 1
a solvent that dissolves the thermoplastic resin
Implementation Method 2
enhancing the heat insulating properties of the resulting coating film
Implementation Method 3
a solvent that dissolves the thermoplastic resin
Data Source
Figure 1
AI summary
Provided is a coating agent capable of forming a coating film having high heat insulating properties. The coating agent according to the present invention is a coating agent used for forming a coating film in an electronic component module in which an electronic component is mounted on a circuit board via a conductive adhesive portion, the conductive adhesive portion being coated with a coating film, the coating agent includes a thermoplastic resin, a solvent that dissolves the thermoplastic resin, and hollow particles, in which a content of the thermoplastic resin is 1.0 wt% or more and 22.0 wt% or less based on 100 wt% of a total content of the thermoplastic resin and the solvent, and a content of the hollow particles is 15.0 parts by weight or more and 50.0 parts by weight or less based on 100 parts by weight of the total content of the thermoplastic resin and the solvent.