Hollow-Pillar Evaporation Layer for Dielectric Liquid Cooling
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Solution Overview
Problem
Current thermal management systems for electronic devices are inadequate in dissipating high heat generated by integrated electronic components, and existing droplet evaporation systems are limited in heat transfer efficiency and compatibility with dielectric liquids.
Innovation Solution
A thermal management system featuring a heat exchanger with a liquid delivery layer and an evaporation layer comprising hollow pillars, where the pillars have a high wetting efficiency and a contact line length of less than 0.0314 mm, facilitating efficient evaporation of dielectric liquids and enhancing heat transfer through non-spherical droplet formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If traditional thermal management systems are used, then the system structure is simple, but the heat dissipation capability is insufficient for high heat generation
Solution Approach 1:
The patent utilizes phase transition of liquid from liquid to vapor state during evaporation to absorb latent heat of vaporization, enabling high heat dissipation rates. The liquid delivery layer delivers liquid to the evaporation layer where it evaporates, absorbing excessive heat generated by electronic components through this phase change mechanism.
Solution Approach 2:
The patent employs a porous evaporation layer with controlled pore size and distribution to facilitate liquid transport and evaporation. The porous structure enables capillary action for liquid delivery and provides large surface area for evaporation, significantly enhancing heat dissipation capability while maintaining a relatively simple overall system structure.
2Power
If spherical droplets are used in evaporation systems, then the system is axisymmetric and simple, but the heat transfer efficiency is limited
Solution Approach 1:
The patent employs non-axisymmetric droplet geometries formed on the porous evaporation layer surface, creating asymmetric contact lines and varying curvature radii. This asymmetry enhances heat transfer efficiency by creating more favorable vapor concentration gradients and reducing thermal resistance compared to traditional axisymmetric spherical droplets.
3Adaptability or versatility
If polar liquids such as water are used, then the liquid forms stable droplets, but the system is not compatible with dielectric liquids
Solution Approach 1:
The patent designs a universal evaporation system that can accommodate both polar and dielectric liquids through optimized porous structure and surface properties. The evaporation layer is engineered to provide appropriate wettability and capillary forces for different liquid types, enabling the same system to function reliably with various liquid compositions without requiring liquid-specific design modifications.
4Manufacturing precision
If the contact line length is reduced, then the wetting efficiency increases, but the droplet evaporation area decreases
Solution Approach 1:
The patent applies local quality optimization by creating heterogeneous pore size distribution and varying surface energy across the evaporation layer. Regions with different local properties are designed to optimize either wetting efficiency or evaporation area depending on the specific operational requirements, allowing the system to achieve high performance in both aspects simultaneously through spatially differentiated characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves higher heat transfer coefficients and improved thermal management by maintaining stable droplets on hollow pillars, increasing evaporation rates and heat dissipation efficiency compared to traditional systems.
Implementation Method 1
The pore is configured to channel the continuous flow of the liquid through the hollow pillar to the evaporation surface
Implementation Method 2
The evaporation surface is configured to maintain a droplet on the respective hollow pillar within a contact line. The evaporation surface has a wetting efficiency of at least about 95%
Implementation Method 3
evaporate the continuous flow of the liquid from droplets maintained on the hollow pillars
Implementation Method 4
Two-phase liquid cooling, such as droplet evaporation, utilizes a latent heat of vaporization to remove excessive heat
Implementation Method 5
a liquid delivery layer thermally coupled to the electronic device and configured to receive a liquid from a source
Data Source
AI summary
A heat exchanger for thermal management of an electronic device includes a liquid delivery layer thermally coupled to the electronic device and configured to receive a liquid from a source. The heat exchanger also includes an evaporation layer comprising hollow pillars configured to receive a continuous flow of the liquid from the liquid delivery layer and evaporate the continuous flow of the liquid from droplets maintained on the hollow pillars. Each hollow pillar has an evaporation surface and a pore configured to channel the continuous flow of the liquid through the hollow pillar to the evaporation surface. The evaporation surface being configured to maintain a droplet on the respective hollow pillar within a contact line. The evaporation surface has a wetting efficiency of at least about 95% and the contact line has a length of less than about 0.0314 mm.