Hollow Process Kit Rings for Thermal Expansion Control
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Solution Overview
Problem
The existing process kits for physical vapor deposition (PVD) chambers, including deposition rings and cover rings, undergo significant thermal expansion when heated, leading to reduced lifespan and increased particle generation due to increased rubbing against chamber components.
Innovation Solution
The use of annular bodies formed from plasma-resistant materials with hollow inner cavities and vent holes, created through 3D printing or similar processes, which reduce thermal expansion by providing a greater surface area for heat dissipation and increasing rigidity, thereby extending the lifespan of the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If deposition rings and cover rings are heated to high temperatures during processing, then the deposition process can be performed, but thermal expansion occurs which decreases the life of the rings
Solution Approach 1:
The patent applies porous or foam-like materials in the ring structures to reduce thermal expansion. The porous structure provides lower thermal mass and reduced thermal strain accumulation, allowing the rings to withstand high temperature processing while maintaining dimensional stability and extending component lifespan.
Solution Approach 2:
The patent uses composite material structures combining different materials with complementary properties. The rings are constructed from composite materials that provide both thermal resistance and mechanical strength, enabling them to operate at high temperatures without excessive thermal expansion or degradation.
2Temperature
If deposition rings and cover rings are heated to high temperatures during processing, then the deposition process can be performed, but thermal expansion increases rubbing against chamber components
Solution Approach 1:
The porous material structure reduces thermal expansion, thereby minimizing rubbing contact between the rings and chamber components. This reduction in mechanical contact directly decreases particle generation from wear and friction, eliminating a harmful byproduct of the high-temperature processing.
3Ease of manufacture
If traditional solid ring structures are used, then manufacturing is simpler, but thermal expansion is greater reducing component life
Solution Approach 1:
The patent employs porous or foam-like materials that can be manufactured using additive manufacturing or foam injection techniques. These methods maintain relative manufacturing simplicity while fundamentally improving thermal performance and component lifespan through the inherent thermal properties of porous structures.
Solution Approach 2:
The patent changes the material density parameter by using porous or foam structures instead of solid materials. This parameter change reduces thermal mass and thermal expansion coefficient, extending component life while maintaining manufacturability through modern fabrication techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design results in up to a 30% decrease in thermal expansion, increasing the number of substrates that can be processed before component replacement is needed and reducing particle generation within the chamber.
Implementation Method 1
The one or more hollow inner cavities are formed in the annular body about the centerline. The one or more hollow inner cavities are arranged in a circle within the annular body.
Implementation Method 2
The annular body is formed from a plasma resistant material. The top surface is configured to face a plasma processing region of a process chamber.
Data Source
AI summary
A process kit ring for use in a plasma processing system is disclosed herein. The process kit ring includes an annular body and one or more hollow inner cavities. The annular body is formed from a plasma resistant material. The annular body has an outer diameter greater than 200 mm. The annular body includes a top surface and a bottom surface. The top surface is configured to face a plasma processing region of a process chamber. The bottom surface is opposite the top surface. The bottom surface is substantially perpendicular to a centerline of the body. The bottom surface is supported at least partially by a pedestal assembly. The one or more hollow inner cavities are formed in the annular body about the centerline. The one or more hollow inner cavities are arranged in a circle within the annular body.