Hollow Shielding Structure for RF Circuit Elements
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electromagnetic shielding structures for semiconductor packages face challenges such as frequency characteristic changes due to dielectric constant differences, difficulty in reusing circuit elements, and increased costs for RF signal matching, which hinder miniaturization and weight reduction in portable electronic devices.
Innovation Solution
A hollow shielding structure using a polymer with metal filler, formed through high-speed dispensing, which includes a shield dam and a shield cover with a gap to maintain frequency characteristics and allow for easy reworking, thereby preventing frequency changes and reducing fabrication costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shield can formed of metallic material is used for electromagnetic wave shielding, then electromagnetic wave shielding performance is improved, but the frequency characteristic of the element changes due to dielectric constant differences
Solution Approach 1:
The patent uses a composite material consisting of an insulator with a shielding layer formed thereon, rather than a simple metallic shield can. This composite structure allows the insulator to maintain the frequency characteristic while the shielding layer provides electromagnetic wave shielding performance.
Solution Approach 2:
The shielding function is localized to specific regions through the shielding layer formed on the insulator, rather than using a complete metallic enclosure. This allows selective shielding while maintaining frequency characteristics in critical areas.
2Object-affected harmful factors
If a shield can is directly soldered to a ground pad of PCB, then electromagnetic wave shielding performance is improved, but the ground pad patterned in the PCB is detached or damaged when the shield can is separated for reuse
Solution Approach 1:
The shielding structure is segmented into a separate shielding component that can be detached from the PCB, allowing the PCB and circuit elements to be reused independently. The shielding function is maintained through the insulator-shielding layer structure rather than direct soldering.
Solution Approach 2:
The shielding structure is designed to be recoverable and reusable. The insulator with shielding layer can be separated from the PCB without damaging the ground pad, enabling the PCB and circuit elements to be recovered and reused in other applications.
3Manufacturing precision
If an insulator with shielding layer is used for electromagnetic wave shielding, then frequency characteristic is maintained, but additional structures for RF signal matching are necessary when applied to various products
Solution Approach 1:
The insulator with shielding layer is designed as a universal component that can be applied to various products and different models without requiring additional RF signal matching structures. The shielding layer configuration provides adaptable electromagnetic wave shielding while maintaining frequency characteristics across different applications.
4Weight of moving object
If miniaturization and weight reduction of electronic components are pursued, then portability is improved, but electromagnetic wave shielding and frequency characteristic maintenance become more difficult
Solution Approach 1:
The shielding structure uses a thin insulator layer with a shielding layer formed thereon, providing effective electromagnetic wave shielding in a miniaturized form factor. This thin-film approach reduces weight and size while maintaining shielding performance and frequency characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains the frequency characteristic of RF signals, enables reusability of circuit elements, and reduces fabrication costs by eliminating the need for RF signal matching structures, facilitating miniaturization and weight reduction in electronic devices.
Implementation Method 1
an electromagnetic wave shielding member capable of simultaneously protecting semiconductor chips or various types of circuit elements from external environments and shielding the elements from electromagnetic waves
Implementation Method 2
formed through high-speed dispensing
Data Source
AI summary
A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.