Hollow Structure Laminate Lithography for Stable Top Plate Formation
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Solution Overview
Problem
In the production of hollow structures, the deformation of film-like top plate portions during baking treatment is a significant issue, and there is a need for improved lithography characteristics to form fine patterns in miniaturized electronic components.
Innovation Solution
A production method for a hollow structure using a laminate of a polyethylene terephthalate film as the support and a negative photosensitive composition as the resist layer, where the resist layer is exposed through the support and developed with an organic solvent to form a negative pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional dry film resist with base film, photosensitive layer, and cover film is used to form the hollow structure, then the hollow structure can be produced, but the film-like top plate portion is likely to be deformed by baking treatment
Solution Approach 1:
The invention extracts and removes the base film (support) from the conventional dry film resist structure, using only the photosensitive layer as the resist film. This eliminates the source of deformation caused by the base film during baking treatment, thereby preventing top plate portion deformation while maintaining the ability to form the hollow structure
Solution Approach 2:
The invention changes the physical and chemical parameters of the resist system by switching from a multi-layer dry film resist to a single-layer photosensitive composition system with specific properties (negative photosensitive composition with controlled viscosity and composition), which does not deform during baking, thus improving shape accuracy and production stability
2Manufacturing precision
If conventional photosensitive compositions are used to form fine patterns for miniaturized electronic components, then the hollow structure can be produced, but further improvement in lithography characteristics is required
Solution Approach 1:
The invention optimizes the parameters of the photosensitive composition by specifying a negative photosensitive composition with controlled viscosity (100-500 cP) and specific chemical composition (epoxy resin, carboxylic acid, and catalyst), which significantly improves lithography characteristics for fine pattern formation while maintaining ease of manufacture through a simplified single-layer application process
Solution Approach 2:
The invention uses a composite photosensitive composition system consisting of epoxy resin, carboxylic acid, and catalyst in specific proportions, which provides superior lithography characteristics for forming fine patterns in miniaturized electronic components while keeping the manufacturing process simple
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the lithography characteristics of the pattern, allowing for the stable production of hollow structures with improved shape and defect reduction.
Implementation Method 1
the resist layer consists of a photosensitive layer formed of a negative photosensitive composition, and when the at least one of the side wall or the top plate portion is formed by using the laminate, an operation of exposing the resist layer via the support
Implementation Method 2
developing the laminate after the exposure with a developing solution containing an organic solvent to form a negative pattern
Data Source
AI summary
A production method for a hollow structure consisting of a concave portion and a top plate portion that blocks an opening surface of the concave portion is adopted, the production method including forming at least one of a side wall or the top plate portion by using a laminate of a support and a resist layer, in which the support consists of a polyethylene terephthalate film having a light transmittance of 85% or more at a wavelength of 365 nm and a haze value of 1.0% or less when irradiated with light having a wavelength of 365 nm, the resist layer consists of a photosensitive layer formed of a negative photosensitive composition, and an operation of exposing the resist layer via the support and developing the laminate after the exposure with a developing solution containing an organic solvent to form a negative pattern. According to this production method, when the side wall or the top plate portion of the hollow structure is formed, it is possible to further improve lithography characteristics (shape and defect reduction) of a pattern, and the hollow structure can be stably produced.