Hollow Structure Thermal Transfer Device for Thermotunneling
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Solution Overview
Problem
Existing thermal transfer devices, such as thermotunneling and thermoelectric devices, face inefficiencies due to challenges in achieving low work function electrodes and controlled electrode spacing, as well as high thermal conductivity, which limits their heat transfer efficiency.
Innovation Solution
The use of first and second electrically conductive substrates with a sealing layer and hollow structures containing conductive material, where the hollow structures are disposed between the substrates to facilitate efficient heat transfer through hot electron tunneling, and the implementation of a method to bond these substrates in a configuration that maintains a nanometer-scale gap for enhanced efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If thermotunneling devices use conventional electrode configurations, then device structure is simple, but heat transfer efficiency is low due to thermal backpath and difficulty in maintaining nanometer-scale electrode spacing
Solution Approach 1:
The device is segmented into multiple functional layers including first and second electrodes, tunneling barrier layers, blocking barrier layers, and hollow structure arrays. This segmentation allows each layer to perform its specific function optimally - the tunneling barrier enables electron tunneling for heat transfer, while the blocking barrier prevents thermal backpath, and the hollow structures provide mechanical support and maintain electrode spacing.
Solution Approach 2:
Hollow structures filled with conductive material serve as intermediary elements between the electrodes. These intermediaries maintain the precise nanometer-scale spacing required for thermotunneling while providing mechanical stability. The hollow structures act as spacers that prevent electrode collapse and maintain the tunneling gap without requiring complex external positioning mechanisms.
2Productivity
If thermoelectric devices use conventional materials, then manufacturing is easier, but thermal conductivity is too high (greater than 20E-3 W/cmK) resulting in low efficiency (2-3%)
Solution Approach 1:
The patent changes the thermal conductivity parameter by introducing hollow structures that scatter phonons and reduce heat transfer through the conductive material. By adjusting the hollow structure size, distribution, and fill ratio, the effective thermal conductivity is reduced to below 10E-3 W/cmK while maintaining electrical conductivity for electron tunneling. This parameter optimization achieves high thermotunneling efficiency without requiring exotic materials.
3Productivity
If electrode spacing is reduced to less than 50 nanometers for efficient thermotunneling, then heat transfer efficiency improves, but achieving and maintaining precise spacing becomes problematic
Solution Approach 1:
The hollow structures are pre-formed with precise dimensions before being integrated into the device. Their sizes and spacing are predetermined during fabrication to automatically maintain the required nanometer-scale gaps between electrodes. This preliminary structuring eliminates the need for post-fabrication adjustment and ensures consistent electrode spacing throughout the device.
Solution Approach 2:
The hollow structures function as thin-film spacers that provide mechanical compliance while maintaining precise spacing. These flexible hollow structures can accommodate thermal expansion and manufacturing tolerances while keeping the electrode gap within the optimal range for thermotunneling, ensuring reliable performance without requiring ultra-precise rigid positioning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for improved heat transfer efficiency by reducing thermal backpath and enhancing unidirectional heat flow, thereby increasing the efficiency of thermotunneling devices and reducing the voltage requirement for electron tunneling, while also addressing the high thermal conductivity issues in thermoelectric devices.
Implementation Method 1
thermotunneling devices transfer heat by tunneling hot electrons from one electrode to another electrode across a nanometer-scale barrier
Implementation Method 2
a plurality of hollow structures having a conductive material, wherein the plurality of hollow structures is contained by the sealing layer between the first and second electrically conductive substrates
Data Source
AI summary
A solid state thermal transfer device includes first and second electrically conductive substrates that are positioned opposite from one another. The solid state thermal transfer device also includes a sealing layer disposed between the first and second electrically conductive substrates and a plurality of hollow structures having a conductive material, wherein the plurality of hollow structures is contained by the sealing layer between the first and second electrically conductive substrates.