Hollow Substrate Image Sensor Package Thickness Reduction
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Solution Overview
Problem
Conventional image sensor chip package structures are too thick, limiting their integration into miniaturized electronic products.
Innovation Solution
A method involving the use of double side adhesive elements, a hollow substrate unit, and fixing glue to securely position and electrically connect image capturing chips within a miniaturized package structure, allowing for the removal of a carrier board and placement on a main circuit board, thereby reducing the overall thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional package structure (PLCC or CLCC technology) is used for image sensor chips, then the image sensor chip can be protected and electrically connected, but the thickness of the package structure becomes too large for miniaturized electronic products
Solution Approach 1:
The image sensor chip is nested within a hollow substrate body that has a receiving space accommodating the chip. The substrate unit itself is hollow, creating a nested structure where components are placed inside cavities rather than requiring external protective enclosures, thereby reducing overall thickness while maintaining protection.
Solution Approach 2:
The patent transitions from conventional planar package structures to a three-dimensional hollow substrate structure. The substrate body is formed with internal cavities and multiple layers, utilizing vertical stacking and internal space to accommodate components, which reduces the horizontal footprint and overall thickness compared to traditional flat package designs.
2Reliability
If conventional package structure is used, then image sensor chip can be assembled with glass cover plate and ceramic base, but the assembly process becomes complex and time-consuming
Solution Approach 1:
The patent merges multiple protective and functional components into a single integrated hollow substrate unit. The substrate body combines the protective enclosure, electrical connection pathways, and structural support functions that were previously separate components (ceramic base, glass cover plate, wire bonds), thereby simplifying the assembly process to a single unit installation.
Solution Approach 2:
The hollow substrate body is pre-formed with integrated receiving spaces, conductive pathways, and mounting structures before assembly. The image sensor chip is positioned within the pre-prepared receiving space, and electrical connections are established through pre-configured pathways, eliminating the need for complex post-assembly operations required by conventional methods.
3Stability of the object's composition
If carrier board is used in conventional packaging, then image sensor chip can be securely mounted, but the overall module thickness cannot be reduced for miniaturization
Solution Approach 1:
The patent extracts and eliminates the separate carrier board component from the package structure. The mounting function previously performed by the carrier board is integrated directly into the hollow substrate body, which provides secure mounting through its own structural features and adhesive elements, thereby removing the need for additional thickness-consuming components.
Solution Approach 2:
The package structure is segmented into functional modules: the hollow substrate body serves as both the mounting substrate and protective enclosure, while separate adhesive elements provide secure attachment. This segmentation allows each component to be optimized independently and assembled in a simplified manner, reducing overall thickness compared to monolithic conventional structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of a miniaturized image capturing module that can be integrated into products with limited space, achieving a reduced thickness and enhanced compactness.
Implementation Method 1
adhesively placing at least one double side adhesive element onto a carrier board; adhesively placing at least one image capturing chip onto the at least one double side adhesive element
Implementation Method 2
forming a fixing glue between the hollow substrate body and the at least one image capturing chip to fix the position of the at least one image capturing chip relative to the hollow substrate body
Data Source
AI summary
A method of manufacturing a miniaturization image capturing module includes adhesively placing a double side adhesive element onto a carrier board; adhesively placing an image capturing chip onto the double side adhesive element; adhesively placing a substrate unit onto the double side adhesive element, the substrate unit including a hollow substrate body adhered to the double side adhesive element and surrounding the image capturing chip; forming a fixing glue between the hollow substrate body and the image capturing chip to fix the position of the image capturing chip relative to the hollow substrate body; electrically connecting the image capturing chip to the substrate unit; positioning a lens unit on the top side of the hollow substrate body, the lens unit including a lens group disposed above the image capturing chip; and then removing the carrier board to expose the double side adhesive element.