Hollow Support Member Vibration Isolation for Semiconductor Tools
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Solution Overview
Problem
Semiconductor fabrication facilities face challenges in isolating low-frequency vibrations that affect production tools, particularly due to outdated vibration specifications in older support tools, leading to reduced production yields and increased costs in replacing equipment.
Innovation Solution
The method and system utilize soundproofing materials and foams within hollow steel and aluminum support members, combined with mechanical fastening and soundproofing adhesives, to create a hybrid vibration isolation system that reduces vibration transmission from the floor to high-precision equipment, allowing newer tools with tighter specifications to operate with older tools.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of stationary object
If hollow steel or aluminum members are used to raise the floor system height, then the weight and cost are reduced, but vibration isolation performance deteriorates
Solution Approach 1:
The patent fills hollow steel or aluminum floor support members with vibration-dampening materials such as foam, rubber, or other porous materials. This transforms the hollow structural members into composite structures that maintain structural integrity while providing vibration isolation. The porous/filled material absorbs vibration energy, preventing transmission to sensitive semiconductor equipment while keeping the overall system weight manageable.
Solution Approach 2:
The patent creates a composite structure by combining hollow metal members with vibration-dampening materials. The metal provides structural strength and load-bearing capacity, while the inserted damping materials provide vibration isolation. This composite approach allows the floor system to simultaneously achieve light weight, structural integrity, and vibration reduction performance.
2Ease of manufacture
If older support tools with outdated vibration specifications are used, then equipment replacement costs are reduced, but manufacturing precision of newer tools deteriorates
Solution Approach 1:
The patent introduces vibration isolation pads and dampening materials as intermediary elements between the older support tools and the newer sensitive equipment. These intermediaries act as a buffer that decouples the vibration characteristics of older tools from the precision requirements of newer tools, allowing incompatible equipment to coexist without requiring full system replacement.
Solution Approach 2:
The patent applies vibration isolation measures locally at critical interfaces rather than requiring universal equipment replacement. By targeting specific support points, connection interfaces, and transmission paths with dampening materials and isolation pads, the system addresses vibration issues locally where they affect precision tools, while leaving the rest of the older equipment unchanged.
3Object-affected harmful factors
If vibration isolation pads and dampening materials are added to floor systems, then vibration frequencies are reduced, but device complexity increases
Solution Approach 1:
The patent merges vibration isolation functionality into existing floor support structures by filling hollow members with dampening materials and integrating isolation pads into connection points. This combines structural support and vibration isolation functions into unified components, avoiding the need for separate, complex isolation systems and reducing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces low-frequency vibrations, improves production yields, extends the life of older equipment, and reduces replacement costs by creating a vibration-reduced environment suitable for nanometer-scale semiconductor processing without extensive structural modifications.
Implementation Method 1
A vibration absorbing foam fills a hollow portion of a vertical support structure separating the base from said upper surface
Implementation Method 2
separating a base of the elevated structure from the floor using a first vibration isolation pad structure
Data Source
AI summary
A method to improve vibration isolation in semiconductor process level inhibits vibration frequencies transmitted though building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads from affecting semiconductor fabrication processes. Sound proofing material and foam is injected into hollow steel and/or aluminum support members and sound proofing adhesives and/or caulking are applied at points of connections in conjunction with mechanical fastening. In various applications, placement of shaped wielded rod utilized for dissipating vibration energy in center of hollow member which is surrounded with sound proofing material and/or foam. In addition, utilization of this method for dedicated MEP (mechanical, electrical, plumbing) support pedestal, only attach as support for MEP lines, as to improve isolation of low frequency vibration.