Hollow Supporting Member for Pipe Integration in Substrate Processing

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Solution Overview

Problem

The existing substrate processing apparatuses face challenges with heat insulation and footprint optimization due to the large space occupied by heat insulators and pipes used for temperature control, which compromise safety and efficiency.

Innovation Solution

A supporting member with a hollow portion is designed to house the pipes, incorporating a heat insulator with a reduced thickness and a pipe clamp to prevent direct contact and maintain safe touch temperatures while minimizing footprint.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a heat insulator is wound around the pipe to secure safety, then the touch safety is improved, but the footprint occupied by the heat insulator and pipe increases

Engineering Contradiction:
Improvetouch safetyVSAvoidfootprint
Core Design Contradiction:
Object-affected harmful factorsVSArea of stationary object

Solution Approach 1:

The pipe is integrated into the hollow portion of the supporting member, merging the pipe structure with the supporting member structure. This eliminates the need for separate heat insulator wrapping while maintaining safety, as the supporting member itself provides the insulation function. The pipe and supporting member form a unified structure that reduces overall footprint.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The supporting member serves multiple functions: it provides structural support, houses the pipe within its hollow portion, and acts as a heat insulator. By making the supporting member multi-functional, the patent eliminates the need for separate heat insulator components, thereby reducing the footprint while maintaining touch safety.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Temperature

If a heat insulator is wound around the pipe, then the temperature control is improved, but the device complexity increases

Engineering Contradiction:
Improvetemperature controlVSAvoiddevice complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The pipe is integrated into the hollow portion of the supporting member, merging previously separate components (pipe and supporting member) into a unified structure. This reduces device complexity by eliminating the need for separate heat insulator installation while maintaining effective temperature control through the integrated design.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively insulates the pipes, maintains safe touch temperatures, and reduces the overall footprint, ensuring both heat insulation and space efficiency in substrate processing apparatuses.

Implementation Method 1

the pipe is insulated by winding a heat insulator around the pipe to secure safety of a touch by a person

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS10553408B2Supporting member and substrate processing apparatus
Publication Date: 2020.02.04 TOKYO ELECTRON LTD
  • US10553408B2 patent drawing
  • US10553408B2 patent drawing
  • US10553408B2 patent drawing

AI summary

A supporting member is configured to support at least one pipe connecting a temperature adjusting unit with a substrate processing apparatus, wherein the temperature adjusting unit adjusts a temperature of an arbitrary component of the substrate processing apparatus, wherein an inside of the supporting member includes a hollow portion and the at least one pipe is arranged in the hollow portion.