Hollow Waveguide Laser System for Picosecond Micromachining
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Solution Overview
Problem
Conventional femtosecond lasers for micromachining are expensive and have low throughput due to high energy requirements and inefficient coupling of laser pulse energy, leading to material removal limitations and debris issues, while nanosecond lasers induce inefficient melting and scarring.
Innovation Solution
A laser material processing system employing a hollow waveguide, pulse shaper, and Multiphoton Intrapulse Interference Phase Scan (MIIPS) for broad bandwidth and efficient pulse shaping, allowing a single laser to operate across multiple workstations and using less expensive picosecond lasers to achieve femtosecond ablation efficiency with closed-loop feedback control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional femtosecond lasers are used for micromachining, then material removal efficiency is improved, but equipment cost increases significantly
Solution Approach 1:
The patent changes the pulse duration parameter from femtosecond to picosecond range, and adjusts the bandwidth parameter to achieve efficient micromachining with less expensive lasers. This parameter transformation allows using cost-effective picosecond lasers while maintaining ablation efficiency through optimized pulse characteristics and bandwidth control.
Solution Approach 2:
The patent creates a simplified version of femtosecond laser functionality using picosecond lasers with adjusted parameters. By copying the essential ablation mechanism of femtosecond lasers through parameter optimization rather than direct replication, the system achieves similar micromachining performance at lower cost.
2Ease of manufacture
If conventional nanosecond lasers are used, then equipment cost is reduced, but thermal damage and scarring increase
Solution Approach 1:
The patent transforms the pulse duration parameter from nanosecond to picosecond range, which fundamentally changes the heating dynamics. This parameter change reduces thermal diffusion time, allowing efficient material removal before significant heat spread occurs, thereby eliminating scarring and thermal damage while using more affordable laser equipment.
Solution Approach 2:
The patent employs periodic pulsed action with picosecond duration, delivering energy in extremely short bursts that prevent cumulative thermal damage. This periodic high-intensity pulsing removes material through ablation rather than melting, avoiding the scarring associated with continuous or long-pulse nanosecond operation.
3Quantity of substance
If high energy per pulse is used for nanosecond laser processing, then material removal is achieved, but coupling efficiency decreases
Solution Approach 1:
The patent changes the pulse duration parameter to picosecond range and optimizes the bandwidth parameter, which fundamentally improves energy coupling efficiency. This parameter transformation allows much lower energy per pulse (microjoule to low millijoule range) to achieve efficient ablation, compared to the high energy (10-100 mJ/pulse) required by nanosecond lasers, thereby reducing wasted energy and improving overall coupling efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces equipment costs, increases micromachining efficiency, and allows for precise control of laser pulses, achieving high throughput and minimizing debris and thermal damage with lower energy requirements.
Implementation Method 1
the waveguide beneficially increases ps or fs pulse bandwidth
Implementation Method 2
A laser material processing system employs a hollow waveguide
Implementation Method 3
micromachining with a laser... quickly removing the workpiece material due to the instantaneous increase of the material temperature into a plasma regime
Implementation Method 4
ionization of the material reduces splatter and debris during operation
Implementation Method 5
pulse shaper and compensation device... Multiphoton Intrapulse Interference Phase Scan
Implementation Method 6
The laser creates a plasma, which couples with the bulk (electron-phonon coupling) and supplies the energy for melting, followed by evaporation
Implementation Method 7
inefficient coupling of the laser pulse energy into a sample
Data Source
AI summary
A laser material processing system and method are provided. A further aspect of the present invention employs a laser for micromachining. In another aspect of the present invention, the system uses a hollow waveguide. In another aspect of the present invention, a laser beam pulse is given broad bandwidth for workpiece modification.