Substrate Integrated Hollow Waveguide for Automotive Radar Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The integration of automotive radar systems in vehicles increases costs due to the complexity and expense of existing semiconductor device packaging technologies, which hinder their widespread adoption for enhanced object detection and collision avoidance systems.
Innovation Solution
A low-cost semiconductor device packaging solution is achieved by using a substrate integrated hollow waveguide formed from multilayer printed circuit board materials, where a hollow waveguide channel is created by joining two waveguide substrates, enabling efficient propagation of radar and mmWave signals between the semiconductor device and a waveguide antenna.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor device packaging technologies are used, then signal propagation between radar systems and antennas is achieved, but the system cost increases significantly
Solution Approach 1:
The patent merges the waveguide structure directly into the PCB substrate by forming conductive traces on the PCB surface that define the waveguide channels. This integration eliminates the need for separate waveguide components and complex packaging assemblies, thereby reducing device complexity while maintaining signal propagation capability.
Solution Approach 2:
The PCB substrate serves multiple functions: it provides mechanical support, electrical connections, and integrates the waveguide structure for signal propagation. This multi-functionality reduces the number of separate components needed, simplifying the overall packaging structure while ensuring reliable signal transmission.
2Reliability
If conventional semiconductor device packaging technologies are used, then signal propagation between radar systems and antennas is achieved, but the system cost increases significantly
Solution Approach 1:
By combining the waveguide structure with the PCB substrate using standard PCB fabrication processes, the invention eliminates the need for separate waveguide manufacturing and assembly steps. This integration reduces manufacturing complexity and cost while maintaining reliable signal propagation through the integrated waveguide channels.
Solution Approach 2:
The PCB substrate itself serves as the waveguide structure, eliminating the need for additional specialized components or assembly processes. The conductive traces on the PCB automatically form the waveguide channels, allowing the substrate to provide both structural support and signal guidance functions through its own geometry.
3Ease of manufacture
If substrate integrated hollow waveguide is used, then manufacturing cost is reduced, but signal propagation efficiency must be maintained
Solution Approach 1:
The integration of waveguide channels directly into the PCB substrate using standard fabrication processes reduces manufacturing cost while maintaining signal propagation efficiency. The conductive traces are formed with precise geometric control to ensure proper waveguide dimensions and signal transmission characteristics.
Solution Approach 2:
The invention controls the geometric parameters of the conductive traces (width, spacing, depth) to optimize waveguide performance. By carefully designing these parameters during PCB fabrication, the integrated structure achieves the necessary signal propagation efficiency while benefiting from lower manufacturing costs compared to conventional separate waveguide assemblies.
Data Source
AI summary
A method of manufacturing a device is provided. The method includes forming a first cavity in a first substrate with the first cavity having a first depth. A second cavity is formed in a second substrate with the second cavity having a second depth. The first cavity and the second cavity are aligned with each other. The first substrate is affixed to the second substrate to form a waveguide substrate having a hollow waveguide with a first dimension substantially equal to the first depth plus the second depth. A conductive layer is formed on the sidewalls of the hollow waveguide. The waveguide substrate is placed over a packaged semiconductor device, the hollow waveguide aligned with a launcher of the packaged semiconductor device.