Hollowed PCB Manufacturing Preventing Etchant Infiltration
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Solution Overview
Problem
The existing methods for manufacturing hollowed printed circuit boards often result in damage to the conductive layer due to etchant infiltration into gaps between the protective layer and the conductive layer, caused by a cliff-like structure between the dielectric and conductive layers.
Innovation Solution
A method involving the formation of a protective layer on the conductive layer before pattern formation, followed by its removal after patterning, with the use of dielectric layers having openings that align to expose the conductive layer externally, thereby preventing etchant infiltration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protective layer is used to protect the first surface of the copper layer, then the conductive layer is protected during processing, but gaps are created between the protective layer and the conductive layer allowing etchant infiltration
Solution Approach 1:
The patent applies preliminary action by forming the protective layer on the first surface of the conductive layer before the etching process. This ensures that the protective barrier is already in place to prevent etchant infiltration during subsequent processing steps, resolving the contradiction between providing protection and preventing harmful factor infiltration.
Solution Approach 2:
The protective layer serves as an intermediary between the etchant and the conductive layer. It acts as a mediator that allows the conductive layer to be protected during processing while preventing direct contact between the harmful etchant and the conductive material, thus resolving the contradiction between protection and harmful factor prevention.
2Reliability
If the protective layer is applied over the entire first surface, then complete coverage is achieved, but adhesion is reduced due to the cliff-like structure between dielectric and conductive layers
Solution Approach 1:
The patent applies local quality by selectively forming the protective layer only in the first opening where it is needed for protection, rather than covering the entire first surface. This localized approach maintains adhesion strength by avoiding the cliff-like structure problem while still providing necessary protective coverage in the critical area.
Solution Approach 2:
The protective layer application is segmented to be applied only in specific regions (the first opening) rather than uniformly across the entire surface. This segmentation allows the protective function to be maintained in critical areas while avoiding adhesion problems in areas where the cliff-like structure exists between the dielectric and conductive layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively prevents damage to the conductive layer by ensuring the protective layer is in place during etching and subsequently removed, maintaining the integrity of the conductive layer.
Implementation Method 1
laminating a first dielectric layer having a first through opening defined therein on a first surface of the electrically conductive layer
Implementation Method 2
forming a protective layer on the first surface of the electrically conductive layer in the first opening
Implementation Method 3
laminating a second dielectric layer having a second through opening defined therein on an opposite second surface of the electrically conductive layer in a manner that the first through opening is aligned with the second through opening
Data Source
AI summary
A method for manufacturing a hollowed printed circuit board includes steps of: providing an electrically conductive layer; laminating a first dielectric layer having a first through opening defined therein on a first surface of the electrically conductive layer; forming a protecting layer on the first surface of the electrically conductive layer in the first opening; creating an electrically conductive pattern in the conductive layer; removing the protecting layer; and laminating a second dielectric layer having a second through opening defined therein on an opposite second surface of the electrically conductive layer in a manner that the first through opening is aligned with the second through opening, thereby a portion of the electrically conductive layer is exposed to exterior through the first through opening and the second through opening.