Homogeneous Composite Substrate Using Polyetherimide Fibers
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Solution Overview
Problem
Existing circuit substrates face challenges in recycling heterogeneous composite materials, such as carbon fiber and thermosetting epoxy resin, which require high-temperature and high-humidity processes, and traditional wet papermaking processes lead to excessive water consumption and energy waste.
Innovation Solution
A homogeneous composite substrate is designed with a woven cloth and fiber membrane made of polyetherimide fibers, where the fiber diameters and structural design allow for thermal processing without separation, enabling recycling and reducing water consumption through a dry thermal pressing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If heterogeneous composite materials (carbon fiber and thermosetting epoxy resin) are used for substrate manufacturing, then structural strength is achieved, but recycling becomes difficult requiring high-temperature and high-humidity processes
Solution Approach 1:
The patent uses homogeneous composite material consisting of thermoplastic resin fibers (polyetherimide) woven into fabric, eliminating the need for heterogeneous material combinations. This single-material approach enables easy recycling through melting and remolding without complex separation processes, while still achieving required structural strength through optimized fiber composition and weaving patterns
Solution Approach 2:
The patent creates a composite structure using thermoplastic resin fibers (polyetherimide) combined with bonding agents and optional inorganic fillers. This composite approach maintains structural integrity while enabling thermal processing for recycling, as the thermoplastic nature allows melting and reformation without degrading the fundamental material structure
2Ease of manufacture
If traditional wet papermaking process is used for substrate preparation, then material formation is achieved, but excessive water consumption and energy waste occur
Solution Approach 1:
The patent replaces the traditional wet papermaking mechanical process with a thermal processing system. Thermoplastic resin fibers are heated to melting point, pressed into desired substrate shapes, and cooled for solidification. This mechanical-to-thermal process substitution eliminates water-intensive steps while reducing energy consumption through controlled heating and pressing cycles
Solution Approach 2:
The patent changes the fundamental processing parameters from wet-state mechanical formation to dry-state thermal processing. By controlling temperature (heating to melting point), pressure (applying pressing force), and time (holding duration), the substrate is formed without water, dramatically reducing water consumption and associated energy requirements for water heating and evaporation
3Adaptability or versatility
If same materials with different melting points are used for homogeneous composite, then material combination is achieved, but separation becomes difficult
Solution Approach 1:
The patent uses a single thermoplastic resin material (polyetherimide) for all fiber components, ensuring complete compositional homogeneity. This eliminates the need for separation processes during recycling, as the entire substrate can be uniformly melted and remolded. The homogeneity is maintained while achieving material versatility through variations in fiber weaving patterns, bonding agent compositions, and additive formulations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate achieves high structural strength, supports circular economy, and avoids water-intensive processes, while maintaining environmental sustainability and suitable dielectric properties for electronic applications.
Implementation Method 1
a melting point of the thermoplastic resin is larger than or equal to 200° C. and smaller than or equal to 300° C.
Implementation Method 2
thermal processing temperature is larger than or equal to 200° C. and smaller than or equal to 240° C.
Data Source
AI summary
A homogeneous composite substrate includes a woven cloth and at least one fiber membrane. The woven cloth includes a plurality of first fibers. The fiber membrane is disposed on at least one surface of the woven cloth, and the fiber membrane includes a plurality of second fibers, in which a material of the first fibers and a material of the second fibers are the same, a fiber diameter of each first fiber is larger than or equal to 20 μm and smaller than or equal to 130 μm, and a fiber diameter of each second fiber is larger than or equal to 3 μm and smaller than or equal to 10 μm.