3D Homogeneous Die Stacking With Symmetric Microbump Alignment
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Solution Overview
Problem
Integrated circuits with different development cycles and layouts, such as those incorporating through silicon vias (TSVs) and non-TSVs, increase research and development costs and manufacturing complexity when packaged together.
Innovation Solution
Implementing homogenous dies with the same design and form, using a three-dimensional die stacking arrangement with symmetrical connectivity through microbumps and TSVs, ensuring alignment and simplifying manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different integrated circuits with different layouts and development cycles are incorporated into the same package, then functional versatility is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent applies homogeneity by using identical or substantially identical integrated circuits (same die design, same process node, same layout) in the stacked package. This eliminates the complexity of integrating different circuit designs, development cycles, and layout variations while maintaining functional versatility through the stacking architecture itself. The homogenous dies simplify manufacturing, alignment, and interconnection processes.
Solution Approach 2:
The patent transitions from planar integration to three-dimensional stacking, moving functionality from a two-dimensional layout to a vertical architecture. This dimensional change allows multiple functional units to be integrated in the vertical dimension through die stacking, achieving functional versatility without increasing planar complexity or requiring integration of different circuit designs.
2Adaptability or versatility
If different integrated circuits with different development cycles are incorporated into the same package, then functional versatility is improved, but development time and costs increase
Solution Approach 1:
By using homogenous dies from the same production line and development cycle, the patent eliminates the time and cost overhead of managing multiple development cycles, toolchains, and design verification processes. The functional versatility is achieved through the standardized stacking architecture rather than through diverse circuit designs, significantly reducing development time.
3Reliability
If through silicon vias (TSVs) are incorporated into integrated circuits, then connectivity and performance are improved, but manufacturing complexity and alignment precision requirements increase
Solution Approach 1:
The patent uses identical TSV configurations, via locations, and interconnection patterns across all stacked dies. This homogeneity in TSV implementation ensures that alignment marks and via positions match perfectly between dies, reducing the effective alignment precision requirements compared to stacking heterogeneous dies with different TSV layouts.
Solution Approach 2:
The patent employs asymmetric TSV arrangements in some embodiments, with different via densities or patterns on different faces of the stacked package. This asymmetric design optimizes connectivity for specific signal routing requirements while maintaining manufacturing feasibility by establishing clear alignment hierarchies between different die layers.
Data Source
AI summary
An integrated circuit device includes multiple microbumps and a top programmable fabric die including a first programmable fabric and a first microbump interface coupled to the multiple microbumps. The integrated circuit device also includes a base programmable fabric die having a second programmable fabric and a second microbump interface coupled to the first microbump interface via a coupling to the multiple microbumps. The top programmable fabric die and the base programmable fabric die have a same design. Moreover, the top programmable fabric die and the base programmable fabric die are arranged in a three-dimensional die arrangement with the top programmable fabric die flipped above the base programmable fabric die.